Patents by Inventor John Edward Heidenreich, III

John Edward Heidenreich, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method/structure for creating aluminum wirebound pad on copper BEOL
    Patent number: 6333559
    Abstract: The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: December 25, 2001
    Assignee: International Business Machines Corporation
    Inventors: Gregory Costrini, Ronald Dean Goldblatt, John Edward Heidenreich, III, Thomas Leddy McDevitt
  • Method/structure for creating aluminum wirebound pad on copper BEOL
    Patent number: 6187680
    Abstract: The present invention provides a method for fabricating an integrated circuit (IC) structure having an Al contact in electrical communication with Cu wiring embedded in the initial semiconductor wafer. In accordance with the method of the present invention, the Al contact is formed in areas of the IC structure which contain or do not contain an underlying region of Cu wiring. The present invention also provides a method of interconnecting the fabricated structure to a semiconducting packaging material through the use of a wirebond or Controlled Collapse Chip Connection (C4) solder.
    Type: Grant
    Filed: October 7, 1998
    Date of Patent: February 13, 2001
    Assignee: International Business Machines Corporation
    Inventors: Gregory Costrini, Ronald Dean Goldblatt, John Edward Heidenreich, III, Thomas Leddy McDevitt
  • Apparatus for producing an inductive plasma for plasma processes
    Patent number: 5650032
    Abstract: An efficient RF coil for inductively coupled plasmas provides either capacitive or inductive coupling to the plasma. The coil has a layered structure including at least one RF coil, an insulator having a low dielectric constant and a second RF magnetic structure. The second RF magnetic structure may be either a second RF coil or a Faraday shield. In a two coil structure, the first RF coil has a first magnetic sense upon energization by an RF source, and the second RF coil has a second magnetic sense opposite the first magnetic sense. An RF source is connected to the high voltage ends of the two RF coil. Uniform capacitive coupling is achieved by the use of a Faraday shield located between the RF coil and the plasma.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: July 22, 1997
    Assignee: International Business Machines Corporation
    Inventors: John Howard Keller, Michael Scott Barnes, John Curt Forster, John Edward Heidenreich, III