Patents by Inventor John Ellison
John Ellison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12281204Abstract: This document provides multiblock copolymers comprising: at least one block obtained from a polyester having an average MN of from about 2,000 to about 200,000, wherein the polyester contains one or more terephthalate units; and at least one block obtained from a polyolefin having an average MN of from about 2,000 to about 200,000. This document further provides methods of making and using the multiblock copolymers, and multilayer films, polymer blends, and molded articles comprising the multiblock copolymers.Type: GrantFiled: April 1, 2020Date of Patent: April 22, 2025Assignees: Regents of the University of Minnesota, Murray State UniversityInventors: Christopher John Ellison, Kevin Michael Miller
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Publication number: 20240372302Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: ApplicationFiled: July 11, 2024Publication date: November 7, 2024Applicant: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Publication number: 20240292158Abstract: Methods and systems for in-situ hearing assessment and customized fitting of a hearing device that can be implemented by a user of the hearing device. Methods and systems for performing: sending instructions to the hearing device to output audio signals having predefined frequencies and loudness levels; outputting the audio signals to an ear of the user while the hearing device is in an operational position for use by the user; measuring user hearing threshold levels at predefined frequencies based on feedback provided by the user when listening to the audio signals; finding a best fit audiogram, based on comparisons of the measured user hearing threshold levels with hearing threshold levels from a plurality of audiograms stored in memory; and programming the hearing device with the best fit audiogram.Type: ApplicationFiled: May 20, 2022Publication date: August 29, 2024Inventors: John Ellison, Hardik Ruparel, Jayaganesh Swaminathan, MingYang Lee, Ruchi J Vyas, Jacob Hall, Adriana Goyette
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Patent number: 12074398Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: GrantFiled: September 12, 2023Date of Patent: August 27, 2024Assignee: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Patent number: 11999548Abstract: A resealable flap device in the form of a sheet, for applying to or incorporating in packaging, comprises: a lower layer of flexible material, and an upper layer of stiff material. The sheet is cut through both layers to outline a flap portion, the cut leaving an edge in a hinge region, the upper layer being removed behind the line of the hinge region. In this way the flexible lower layer forms a hinge that is easy to handle and does not spring back, while the stiff upper layer maintains the shape of the flap.Type: GrantFiled: April 27, 2023Date of Patent: June 4, 2024Assignee: OPM ADVANCE LIMITEDInventors: Ian David Michael Bell, Christopher John Ellison
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Patent number: 11945945Abstract: A resin including up to 99.99 weight percent (wt. %) of a first polyolefin grafted with a functional group selected from an ethylenically unsaturated carboxylic acid, a carboxylic acid anhydride, an ester functional group or a combination thereof; and 0.01 to 3.0 wt. % of a tin oxide-based catalyst, where the resin includes 0.2 wt. % to 1.5 wt. % of the functional group from the first polyolefin, the wt. % based on a total weight of the resin. The first polyolefin can be selected from a polyethylene, a polypropylene, an ethylene/alpha-olefin copolymer, a propylene/alpha-olefin copolymer and combinations thereof. The tin oxide-based catalyst can be selected from dibutyltin oxide, dioctyltin oxide and combinations thereof. The resin can be used in a multilayer structure, where a Layer A comprises the resin and a Layer B comprises a polyester, where a first major surface of Layer A is in adhering contact with the second major surface of Layer B.Type: GrantFiled: May 22, 2019Date of Patent: April 2, 2024Assignees: Dow Global Technologies LLC, Regents of The University of MinnesotaInventors: Kunwei Liu, Alex Michael Jordan, Christopher John Ellison, Christopher Ward Macosko, Christopher M. Thurber, Wenyi Huang, Thomas H. Peterson
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Publication number: 20240006822Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: ApplicationFiled: September 12, 2023Publication date: January 4, 2024Applicant: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Cooper, Mark R. Gray, William Tanis, Steven E. Minich
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Patent number: 11817657Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.Type: GrantFiled: August 24, 2022Date of Patent: November 14, 2023Assignee: FCI USA LLCInventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
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Patent number: 11799246Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: GrantFiled: September 2, 2022Date of Patent: October 24, 2023Assignee: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Patent number: 11791585Abstract: Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.Type: GrantFiled: January 27, 2021Date of Patent: October 17, 2023Assignee: FCI USA LLCInventors: James J. Muha, Scott Martin, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Publication number: 20230268483Abstract: A method of making a porous film includes disposing a slurry on a substrate, solidifying the slurry to yield a film on the substrate, and subliming the organic sublimable material to yield the porous film on the substrate. The slurry includes an electrochemically active material, an electrically conductive material, and a binder dispersed in an organic sublimable material. The electrochemically active material and the electrically conductive material are different. A slurry includes a solid component including an electrochemically active material, an electrically conductive material, and a binder; and a liquid component including an organic sublimable material, wherein the electrochemically active material and the electrically conductive material are different, and the solid component is dispersed in the liquid component.Type: ApplicationFiled: February 21, 2023Publication date: August 24, 2023Inventors: Christopher John Ellison, Charles Buddie Mullins, Samantha Nicole Lauro, Joshua Paul Pender, Han Xiao, Jason Alexander Weeks, JR., James Norman Burrow, JR.
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Publication number: 20230257179Abstract: A resealable flap device in the form of a sheet, for applying to or incorporating in packaging, comprises: a lower layer of flexible material, and an upper layer of stiff material. The sheet is cut through both layers to outline a flap portion, the cut leaving an edge in a hinge region, the upper layer being removed behind the line of the hinge region. In this way the flexible lower layer forms a hinge that is easy to handle and does not spring back, while the stiff upper layer maintains the shape of the flap.Type: ApplicationFiled: April 27, 2023Publication date: August 17, 2023Inventors: Ian David Michael BELL, Christopher John ELLISON
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Patent number: 11667448Abstract: A resealable flap device in the form of a sheet, for applying to or incorporating in packaging, comprises: a base layer 30 of flexible material, and an upper layer 40 of stiff material. The sheet is cut (15) through both layers to outline a flap portion 14, the cut leaving an edge in a hinge region 18, the upper layer being removed behind the line of the hinge region 18. In this way the flexible base layer forms a hinge 18 that is easy to handle and does not spring back, while the stiff upper layer maintains the shape of the flap.Type: GrantFiled: June 23, 2020Date of Patent: June 6, 2023Assignee: OPM ADVANCE LIMITEDInventors: Ian David Michael Bell, Christopher John Ellison
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Publication number: 20230107361Abstract: Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.Type: ApplicationFiled: January 27, 2021Publication date: April 6, 2023Applicant: FCI USA LLCInventors: James J. Muha, Scott Martin, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Publication number: 20230062661Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: ApplicationFiled: September 2, 2022Publication date: March 2, 2023Applicant: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Publication number: 20220407269Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.Type: ApplicationFiled: August 24, 2022Publication date: December 22, 2022Applicant: FCI USA LLCInventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
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Patent number: 11469554Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.Type: GrantFiled: January 26, 2021Date of Patent: October 11, 2022Assignee: FCI USA LLCInventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
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Patent number: 11469553Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.Type: GrantFiled: January 26, 2021Date of Patent: October 11, 2022Assignee: FCI USA LLCInventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
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Publication number: 20220195127Abstract: This document provides multiblock copolymers comprising: at least one block obtained from a polyester having an average MN of from about 2,000 to about 200,000, wherein the polyester contains one or more terephthalate units; and at least one block obtained from a polyolefin having an average MN of from about 2,000 to about 200,000. This document further provides methods of making and using the multiblock copolymers, and multilayer films, polymer blends, and molded articles comprising the multiblock copolymers.Type: ApplicationFiled: April 1, 2020Publication date: June 23, 2022Inventors: Christopher John Ellison, Kevin Michael Miller
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Patent number: D1026638Type: GrantFiled: July 8, 2022Date of Patent: May 14, 2024Inventor: John Ellison