Patents by Inventor John Eugene Berg

John Eugene Berg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photonic quantum computer assembly
    Patent number: 11892693
    Abstract: A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. The device also includes a first interconnect between the quantum circuit and the electronic circuit and a second interconnect between the quantum circuit and the electronic circuit.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: February 6, 2024
    Assignee: Psiquantum, Corp.
    Inventors: Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John Eugene Berg, Ramakanth Alapati
  • Quantum computing die assembly with thru-silicon vias
    Patent number: 11550108
    Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: January 10, 2023
    Assignee: PSIQUANTUM, CORP.
    Inventors: Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John Eugene Berg, Ramakanth Alapati
  • Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
    Patent number: 11493713
    Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: November 8, 2022
    Assignee: PSIQUANTUM, CORP.
    Inventors: Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John Eugene Berg, Ramakanth Alapati
  • Quantum computing die assembly with thru-silicon vias and connected logic circuit
    Patent number: 11493714
    Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: November 8, 2022
    Assignee: PSIQUANTUM, CORP.
    Inventors: Gabriel J. Mendoza, Matteo Staffaroni, Albert Wang, John Eugene Berg, Ramakanth Alapati