Patents by Inventor John F. Bohland, Jr.

John F. Bohland, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective metallization process
    Patent number: 5510216
    Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: April 23, 1996
    Assignee: Shipley Company Inc.
    Inventors: Gary S. Calabrese, Jeffrey M. Calvert, Mu-San Chen, Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger, Jr., John F. Bohland, Jr.
  • Selective metallization process
    Patent number: 5468597
    Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: November 21, 1995
    Assignee: Shipley Company, L.L.C.
    Inventors: Gary S. Calabrese, Jeffrey M. Calvert, Mu-San Chen, Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger, Jr., John F. Bohland, Jr.