Patents by Inventor John F Casey
John F Casey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11460408Abstract: A system for geochemical characterization of a sample includes a closed reaction chamber configured to perform a high temperature and high-pressure acid digestion test, a spectrometry system configured for performing trace element analysis, and a controller. The controller includes a processor and a memory. The memory includes instructions stored thereon, which, when executed by the processor, cause the system to mineralize the sample based on a microwave process using the closed reaction chamber, and perform trace element analysis on the mineralized sample by the spectrometry system.Type: GrantFiled: December 15, 2020Date of Patent: October 4, 2022Assignee: UNIVERSITY OF HOUSTON SYSTEMInventors: John F. Casey, Yongjun Gao, Weihang Yang, Jiaxuan Li
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Publication number: 20210181117Abstract: A system for geochemical characterization of a sample includes a closed reaction chamber configured to perform a high temperature and high-pressure acid digestion test, a spectrometry system configured for performing trace element analysis, and a controller. The controller includes a processor and a memory. The memory includes instructions stored thereon, which, when executed by the processor, cause the system to mineralize the sample based on a microwave process using the closed reaction chamber, and perform trace element analysis on the mineralized sample by the spectrometry system.Type: ApplicationFiled: December 15, 2020Publication date: June 17, 2021Inventors: John F. Casey, Yongjun Gao, Weihang Yang, Jiaxuan Li
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Publication number: 20080238586Abstract: A solution to the problem of creating a controlled impedance coaxial connection to a quasi-coaxial transmission line at a location interior to a substrate and not along an edge is to radially butt-mount the connector to via-like structure on the backside of the substrate. By butt-mounting we mean that the connector itself does not extend into the substrate, but is attached to its surface. The via-like structure includes a conductor that extends through the substrate and into the confines of the quasi-coaxial transmission line proper, where it electrically connects to the center conductor of the quasi-coaxial transmission line. The butt-mounting of the coaxial connector may be accomplished with solder or conductive epoxy.Type: ApplicationFiled: March 29, 2007Publication date: October 2, 2008Inventors: John F. Casey, Donald E. Schott, Thomas L. Mulcahy, Ling Liu
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Patent number: 7265043Abstract: Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.Type: GrantFiled: August 25, 2006Date of Patent: September 4, 2007Assignee: Agilent Technologies, Inc.Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Jr., Rosemary O. Johnson, Julius Botka
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Patent number: 7125752Abstract: In a method for making a microwave circuit, a first dielectric is deposited over a ground plane, and then a conductor is formed on the first dielectric. A second dielectric is then deposited over the conductor and first dielectric, thereby encapsulating the conductor between the first and second dielectrics. In one embodiment, a ground shield layer is formed over the first and second dielectrics by 1) precoating the first and second dielectrics with a metallo-organic layer, and then 2) depositing a thickfilm ground shield layer over the precoat layer. Alternately, a ground shield layer is formed over the first and second dielectrics by 1) placing a polymer screen over the first and second dielectrics, and applying pressure to the polymer screen until it at least partially conforms to a contour of the dielectrics, and then 2) printing a thickfilm ground shield layer through the polymer screen.Type: GrantFiled: April 25, 2005Date of Patent: October 24, 2006Assignee: Agilent Technologies, Inc.Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Jr., Rosemary O. Johnson, Julius Botka
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Patent number: 7098413Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. A method for making a switch with a photoimaged channel plate is also disclosed.Type: GrantFiled: January 31, 2005Date of Patent: August 29, 2006Assignee: Agilent Technologies, Inc.Inventors: Marvin Glenn Wong, John F. Casey
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Patent number: 7022251Abstract: Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.Type: GrantFiled: June 19, 2003Date of Patent: April 4, 2006Assignee: Agilent Technologies, Inc.Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Jr., Rosemary O. Johnson
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Patent number: 7019235Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. Switches using photoimaged channel plates, and a method for making a switch with a photoimaged channel plate, are also disclosed.Type: GrantFiled: January 13, 2003Date of Patent: March 28, 2006Assignee: Agilent Technologies, Inc.Inventors: Marvin Glenn Wong, John F. Casey
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Patent number: 7014784Abstract: In one embodiment, a plurality of thickfilm dielectric layers are printed on a substrate, with each successive layer being printed over a previous layer, and with each layer having sloped walls. After printing a first subset of the plurality of thickfilm dielectric layers, a first conductive thickfilm is printed over at least the walls of the first subset of dielectric layers. Then, after printing a second subset of the plurality of thickfilm dielectric layers, a second conductive thickfilm is printed over the second subset of dielectric layers (with the first and second conductive thickfilms being electrically coupled).Type: GrantFiled: March 3, 2004Date of Patent: March 21, 2006Assignee: Agilent Technologies, Inc.Inventors: Lewis R. Dove, John F. Casey
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Patent number: 6953698Abstract: Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.Type: GrantFiled: June 19, 2003Date of Patent: October 11, 2005Assignee: Agilent Technologies, Inc.Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Jr., Rosemary O. Johnson, Julius Botka
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Patent number: 6897387Abstract: Disclosed herein is a switch having a photoimaged channel plate and a switching fluid. The photoimaged channel plate defines at least a portion of a number of cavities, a first cavity of which is defined by a first channel formed in the photoimaged channel plate. The switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid.Type: GrantFiled: October 31, 2003Date of Patent: May 24, 2005Assignee: Agilent Technologies, Inc.Inventors: Marvin Glenn Wong, John F. Casey
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Patent number: 6867669Abstract: Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.Type: GrantFiled: June 23, 2003Date of Patent: March 15, 2005Assignee: Agilent Technologies, Inc.Inventors: Lewis R. Dov, John F. Casey
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Publication number: 20040258841Abstract: Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer. The first layer is then oven dried. Thereafter, additional layers of thickfilm dielectric are deposited on top of the first layer, with each layer being oven dried after it is deposited. The deposited layers are then fired.Type: ApplicationFiled: June 19, 2003Publication date: December 23, 2004Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Rosemary O. Johnson
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Publication number: 20040257194Abstract: Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.Type: ApplicationFiled: June 19, 2003Publication date: December 23, 2004Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Rosemary O. Johnson
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Publication number: 20040256350Abstract: Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.Type: ApplicationFiled: June 19, 2003Publication date: December 23, 2004Inventors: John F. Casey, Lewis R. Dove, Ling Liu, James R. Drehle, R. Frederick Rau, Rosemary O. Johnson
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Publication number: 20040257179Abstract: Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.Type: ApplicationFiled: June 23, 2003Publication date: December 23, 2004Inventors: Lewis R. Dov, John F. Casey
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Patent number: 6781075Abstract: Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.Type: GrantFiled: August 12, 2003Date of Patent: August 24, 2004Assignee: Agilent Technologies, Inc.Inventors: Lewis R Dove, John F Casey, Marvin Glenn Wong
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Patent number: 6777630Abstract: An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal.Type: GrantFiled: April 30, 2003Date of Patent: August 17, 2004Assignee: Agilent Technologies, Inc.Inventors: Lewis R Dove, Paul Thomas Carson, John F Casey, Marvin Glenn Wong
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Publication number: 20040144632Abstract: Disclosed herein is a switch having a photoimaged channel plate and a switching fluid. The photoimaged channel plate defines at least a portion of a number of cavities, a first cavity of which is defined by a first channel formed in the photoimaged channel plate. The switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid.Type: ApplicationFiled: October 31, 2003Publication date: July 29, 2004Inventors: Marvin Glenn Wong, John F. Casey
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Publication number: 20040134763Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. Switches using photoimaged channel plates, and a method for making a switch with a photoimaged channel plate, are also disclosed.Type: ApplicationFiled: January 13, 2003Publication date: July 15, 2004Inventors: Marvin Glenn Wong, John F. Casey