Abstract: The present invention is directed to a method for improving the adhesion between a conductive laminate and a substrate material. In a preferred embodiment of the present invention, the conductive laminate is a copper film and the substrate material comprises polyphenylene ether resin. The method involves admixing a copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride with the polyphenylene ether resin. The copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride is preferably a polystyrene maleic anhydride copolymer or a rubber modified polystyrene maleic anhydride copolymer.

Abstract: This invention is directed to an extruded thermoplastic, thin-walled, high definition profile structure having a central hollow cross sectional member with at least two flange members extending perpendicularly therefrom and longitudinally therewith wherein at least one flange member extends from one side of the cross sectional member and at least one flange member extends from the other side thereof. Preferably, there are three flange members extending from one side forming channel-like recesses and one flange extending from the other side of the cross sectional member.Also included herein are particular thermoplastic resins that can be employed in making the profile structure of this invention. For example, the profile can be a composite comprising a substrate of acrylonitrile-butadiene-styrene and a thin outer layer of polyvinyl chloride or a blend of polyvinyl chloride and acrylic-styrene-acrylonitrile.