Patents by Inventor John F, Magnani

John F, Magnani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency filtered interface
    Patent number: 11955941
    Abstract: A connector including a first body, a second body, a dielectric film and one or more conductive traces. The first body has first and second opposite sides and includes an elastomeric absorber material with ferrite or iron powder dispersed therein. The second body includes the elastomeric absorber material with ferrite or iron powder dispersed therein. The dielectric film is disposed on surfaces of the first body to extend along and between the first and second opposite sides. The one or more conductive traces are sandwiched between the second body and the dielectric film to extend along and between the first and second opposite sides. The connector can be installed into a conductive aperture, to channel RF energy through it and thus effecting an absorptive RF filter for a signal.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 9, 2024
    Assignee: RAYTHEON COMPANY
    Inventors: John W. Hauff, Orlando F. Perez, John F. Magnani
  • Radio frequency filtering of printed wiring board direct current distribution layer
    Patent number: 11452202
    Abstract: A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: September 20, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: John W. Hauff, Orlando F. Perez, John F. Magnani
  • RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DISTRIBUTION LAYER
    Publication number: 20220192009
    Abstract: A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 16, 2022
    Inventors: John W. Hauff, Orlando F. Perez, John F. Magnani
  • RADIO FREQUENCY FILTERED INTERFACE
    Publication number: 20220029595
    Abstract: A connector including a first body, a second body, a dielectric film and one or more conductive traces. The first body has first and second opposite sides and includes an elastomeric absorber material with ferrite or iron powder dispersed therein. The second body includes the elastomeric absorber material with ferrite or iron powder dispersed therein. The dielectric film is disposed on surfaces of the first body to extend along and between the first and second opposite sides. The one or more conductive traces are sandwiched between the second body and the dielectric film to extend along and between the first and second opposite sides. The connector can be installed into a conductive aperture, to channel RF energy through it and thus effecting an absorptive RF filter for a signal.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 27, 2022
    Inventors: John W. Hauff, Orlando F. Perez, John F, Magnani