Abstract: A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.

Abstract: A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.

Abstract: An electronic cartridge which has a fastener that can attach the cartridge to a motherboard. The fastener is captured by a cover that also captures a substrate. The substrate may be coupled to a connector that is mounted to the motherboard. The fastener may be attached to a retention mechanism that is also mounted to the motherboard. The fastener may have a threaded portion that is screwed into a corresponding threaded aperture of the retention mechanism. The fastener and retention mechanism provide a rugged attachment of the cartridge to the motherboard. The cover and retention mechanism may be constructed from an electrically conductive material which provides a shield to electro-magnetic interference (EMI).

Abstract: A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to “float” and expand at a different rate than the substrate when the package is thermally cycled.

Abstract: An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a first surface and a second surface opposite the first surface. Circuit elements are formed within the first surface. A plurality of bump contacts are located on the first surface and connected to the circuit elements. Bond pads that are also connected to circuit elements are located within or on the second surface.

Abstract: An electronic package which contains discrete resistive and capacitive components used to control the operating device of an integrated circuit located within the package. The package has a bonding shelf that has a plurality of bond fingers which are connected to the integrated circuit. The discrete passive components are mounted to the bonding shelf and connected to the bond fingers by lead traces. The lead traces terminate at the discrete devices so that the resistor and capacitor cannot be accessed through the external contacts of the package. The integrated circuit and discrete components are typically enclosed by a molded plastic material to prevent physical access to the devices without damaging the package.

Abstract: A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux.

Abstract: The invention is directed to an improved water jet propulsion system for a marine vehicle. The water jet propulsion system of the present invention incorporates an unconventional and compact design including a short, steep, hydrodynamically designed inlet duct adapted for mounting to the surface of the vehicle hull and extending internally thereof, a water jet pump having an inlet end attached to the outlet end of the inlet duct, a motor for rotating the pump impeller, a drive shaft located completely outside of the flow path connecting the motor with the pump impeller, a flow passage for discharging accelerated flow received from the pump in a generally rearward direction, and a steering and reversing mechanism pivotably mounted about a substantially vertical axis to the aft portion of the vehicle hull for redirect accelerated flow received from the outlet nozzle so as to provide maneuvering capability to the vehicle.

Abstract: An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.

Abstract: An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.

Abstract: An electronic assembly that includes an electronic package which is coupled to a circuit board by a plurality of metal spheres that are captured by an interposer. The metal spheres electrically couple a plurality of first conductive pads on the electronic package with a plurality of second conductive pads on the circuit board. The spheres are pressed into operative contact with the conductive pads by a clamp adapted to apply a pressure to the electronic package. The metal spheres are captured by the interposer so that the spheres can rotate relative to the electronic package and the circuit board. The rotating spheres function as bearings which allow the interposer and package to be removed from the clamp and board without detaching the clamp. The electronic package can be coupled to the circuit board by merely pushing the package and interposer between the clamp and board until the metal spheres are properly aligned with the conductive pads.

Abstract: An electronic package assembly which has a first electrical device mounted to a housing and a second electrical device attached to the lid of the package. The first and second devices are completely encapsulated by the lid and housing, and are typically coupled to a printed circuit board by pads on the bottom surface of the package. The electrical devices may be active or passive elements that are coupled together by conductive pads located on the top and bottom surfaces of the housing and lid, respectively. The conductive pads are typically soldered together when the lid is attached to the housing.