Abstract: Closed cell chitin foam is provided. The closed-cell chitin foam composition does not absorb water, is biodegradable, and is mechanically characterized by a density range of 16 to 800 kg/m3, closed-cell pore sizes ranging from 50 microns to 1 mm, an elastic modulus of 3 to 175 MPa, and a tensile strength of 0.15 to 6.5 MPa. The chitin is at least 70% acetylated. In one aspect, the foam is enclosed in a shell e.g. in the form of a surfboard. Chitin foam according to this invention is fully biodegradable. The chitin foam overcomes the current problems with foams that contain polyurethane and polystyrene, and which are manufactured from petroleum-based sources. Petroleum based foams are not renewable, have an adverse impact on our environment, and pose significant health hazards to those who manufacture them. The chitin foam with its water-based manufacturing process and naturally sourced chitin, solves these problems.

Abstract: Closed cell chitin foam is provided. The closed-cell chitin foam composition does not absorb water, is biodegradable, and is mechanically characterized by a density range of 16 to 800 kg/m3, closed-cell pore sizes ranging from 50 microns to 1 mm, an elastic modulus of 3 to 175 MPa, and a tensile strength of 0.15 to 6.5 MPa. The chitin is at least 70% acetylated. In one aspect, the foam is enclosed in a shell e.g. in the form of a surfboard. Chitin foam according to this invention is fully biodegradable. The chitin foam overcomes the current problems with foams that contain polyurethane and polystyrene, and which are manufactured from petroleum-based sources. Petroleum based foams are not renewable, have an adverse impact on our environment, and pose significant health hazards to those who manufacture them. The chitin foam with its water-based manufacturing process and naturally sourced chitin, solves these problems.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: A method of forming foam includes providing a foam with at least one of chitosan, chitin, or chitosan oligosaccharide, where the foam has a density of 1 g/cm3 or less. The method further includes placing the foam between tooling, applying heat to the foam, and pressing the foam into a shape using the tooling.

Abstract: A composite material includes a porous foam, having a density of less than 1 g/cm3, with a polymer matrix including chitosan, chitin, or chitosan oligosaccharide, and a first laminate adhered to a first surface of the porous foam.

Abstract: A composite material includes a polymer matrix with a polymer having D-glucosamine monomer units and 50% or fewer N-acetyl-D-glucosamine monomer units. A salt can be disposed in the polymer matrix. A dispersed phase is disposed in the polymer matrix with the salt, and the dispersed phase and the polymer matrix form a porous composite foam. The porous composite foam includes, by weight, 0.5-3 times the dispersed phase to the polymer matrix, and the porous composite foam has a density of less than 1 g/cm3.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: Closed cell chitin foam is provided. The closed-cell chitin foam composition does not absorb water, is biodegradable, and is mechanically characterized by a density range of 16 to 800 kg/m3, closed-cell pore sizes ranging from 50 microns to 1 mm, an elastic modulus of 3 to 175 MPa, and a tensile strength of 0.15 to 6.5 MPa. The chitin is at least 70% acetylated. In one aspect, the foam is enclosed in a shell e.g. in the form of a surfboard. Chitin foam according to this invention is fully biodegradable. The chitin foam overcomes the current problems with foams that contain polyurethane and polystyrene, and which are manufactured from petroleum-based sources. Petroleum based foams are not renewable, have an adverse impact on our environment, and pose significant health hazards to those who manufacture them. The chitin foam with its water-based manufacturing process and naturally sourced chitin, solves these problems.

Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.

Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

Abstract: A method for detecting a coating on a bottle includes directing light at a first point of incidence on the bottle and detecting a first intensity of reflected light from the first point of incidence on the bottle. Further, light is directed at a second point of incidence on the bottle and a second intensity of reflected light from the second point of incidence on the bottle is detected. The first intensity is compared to the second intensity to determine whether the coating on the bottle has been uniformly deposited.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

Abstract: The present invention refers to an apparatus for the plasma treatment of hollow bodies, comprising a vacuum treatment chamber and means for generating the plasma, which apparatus is characterized in that the means for generating the plasma comprise an electrode of a substantially U-shaped cross-section, which is arranged in the vacuum treatment chamber, the hollow bodies immersing at least in part into the U-shaped electrode when the plasma treatment is carried out, and being moved at least temporarily relative to the U-shaped electrode.

Abstract: A method for coating a substrate surface by PECVD is provided, the method comprising generating a plasma from a gaseous reactant comprising an organosilicon precursor and optionally O2. The lubricity, hydrophobicity and/or barrier properties of the coating are set by setting the ratio of the O2 to the organo silicon precursor in the gaseous reactant, and/or by setting the electric power used for generating the plasma. In particular, a lubricity coating made by said method is provided. Vessels coated by said method and the use of such vessels protecting a compound or composition contained or received in said coated vessel against mechanical and/or chemical effects of the surface of the uncoated vessel material are also provided.

Abstract: A device for supplying a large number of consumer stations with a predetermined amount of a process medium, in particular a coating device for containers, has a supply line for the process medium and a connection at the consumer station. In order to make such a device simpler from the structural point of view and less expensive, a unit is used, which keeps a predetermined flow rate constant and which comprises a capillary path extending before each connection and dimensioned in accordance with the predetermined amount of process medium, and a unit which is associated with a plurality of connections and which is used for maintaining a defined flow velocity along the capillary path.