Abstract: A probe device is configured to insert optical fiber probes directly into a v-groove coupler on an optical integrated circuit (IC) device. The probe device may include a probe holder comprising with a slot. A fiber holder may insert into the slot. The fiber holder may comprise a body with a first portion and second portion disposed at an angle relative to one another so that the first portion is shorter than the second portion. The body may have a bottom with grooves disposed therein, the grooves having dimensions to receive part of an optical fiber probes therein. In use, the fiber holder can arrange the optical fiber probes to extend into the v-grooves of the v-groove coupler of an optical IC on a wafer. The device may incorporate an alignment mechanism that permits the fiber holder to move or “self-align” in response to contact between the optical fiber probes and structure of the v-groove coupler of an optical IC on a wafer.

Abstract: A probe device is configured to insert optical fiber probes directly into a v-groove coupler on an optical integrated circuit (IC) device. The probe device may include a probe holder comprising with a slot. A fiber holder may insert into the slot. The fiber holder may comprise a body with a first portion and second portion disposed at an angle relative to one another so that the first portion is shorter than the second portion. The body may have a bottom with grooves disposed therein, the grooves having dimensions to receive part of an optical fiber probes therein. In use, the fiber holder can arrange the optical fiber probes to extend into the v-grooves of the v-groove coupler of an optical IC on a wafer. The device may incorporate an alignment mechanism that permits the fiber holder to move or “self-align” in response to contact between the optical fiber probes and structure of the v-groove coupler of an optical IC on a wafer.

Abstract: Approaches for performing in line wafer testing are provided. An approach includes a method that includes generating a radio frequency (RF) test signal, and applying the RF test signal to a device under test (DUT) in a wafer using a buckling beam probe set with a predefined pitch. The method also includes detecting an output RF signal from the DUT in response to the applying the RF test signal to the DUT, and sensing at least one frequency component of the detected output RF signal.

Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.

Abstract: A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate.