Abstract: A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a RGB structure having a plurality of layers. The RGB structure includes a first via hole formed into the layers through one side of the RGB structure and filled with a first via and a second via hole formed into the layers through an opposite side of the RGB structure and filled with a second via, where the first and second vias are electrically coupled by an interconnect. Prepreg buildup layers are formed on the one side of the PCB structure and prepreg buildup layers are formed on the opposite side of the PCB structure. A beamforming IC is formed on the prepreg buildup layers on the one side of the PCB structure and an antenna radiating element is formed on the prepreg buildup layers on the opposite side of the PCB structure.

Abstract: A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes a PCB structure having a plurality of dielectric layers and conductive layers. A beamforming IC is formed on one side of the PCB structure and a patch antenna radiating element is formed at an opposite side of the PCB structure from the beamforming IC, where one of the dielectric layers is formed over the radiating element so that the radiating element is buried.

Abstract: A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer. Microvias extend through the first prepreg layer that electrically couple the thick copper layer to the signal layer and microvias extend through the second prepreg layer that electrically couple the thin copper layer to the signal layer, where the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

Abstract: A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes a RGB structure having a plurality of prepreg buildup layers including microvias on one side and on an opposite side. A plurality of beamforming ICs are formed on the prepreg buildup layers on the one side of the RGB structure and a plurality of horn antenna radiating element are formed on the prepreg buildup layers on the opposite side of the RGB structure, where each of the horn antenna radiating elements includes a feed structure formed in one of the prepreg buildup layers and a horn aperture extending from the feed structure and formed in a metal layer.

Abstract: An antenna backplane including a printed circuit board (PCB) having a first differential pair with a first conductor and a second conductor and a second differential pair with a third conductor and a fourth conductor. The first conductor is positioned a first distance from the second differential pair and the second conductor is positioned a second distance from the second differential pair of conductors, where the first distance is greater than the second distance. The third conductor is positioned the second distance from the first differential pair and the fourth conductor is positioned a third distance from the first differential pair, where the third distance is greater than the second distance. A phase-shifting series resonant circuit is coupled between the first conductor and the fourth conductor that provides approximately an odd-integer multiple of a 180 degree phase shift at a predetermined frequency.

Abstract: A printed circuit board (PCB), such as an antenna backplane, including a first conductor and a second conductor forming a differential pair, a first junction and a second junction connected to the first conductor and the second conductor, respectively, and a first impedance matching stub and a second impedance matching stub connected to the first conductor and the second conductor, respectively. The differential pair has a first impedance, the first junction and the second junction have a second impedance, and the first impedance matching stub and the second impedance matching stub match the second impedance to the first impedance. The PCB may have a connector that has differential pins joined to the first and second junctions, and the first impedance matching stub and the second impedance matching stub match an impedance of the junctions, pins, and a connector to the first impedance.

Abstract: An identifier for a conduit includes a first tag having a body with a first aperture formed therein for receiving the conduit and a first identifying feature, and a second tag having a body with a second aperture formed therein for receiving the conduit and a second identifying feature that matches the first identifying feature. The first tag is attached to the conduit adjacent one end, the second tag is attached to the conduit adjacent another end, and the ends are identified as ends of the same conduit by the matching first and second identifying features.

Abstract: An identifier for a conduit includes a first tag having a body with a first aperture formed therein for receiving the conduit and a first identifying feature, and a second tag having a body with a second aperture formed therein for receiving the conduit and a second identifying feature that matches the first identifying feature. The first tag is attached to the conduit adjacent one end, the second tag is attached to the conduit adjacent another end, and the ends are identified as ends of the same conduit by the matching first and second identifying features.

Abstract: An identifier for a conduit includes a substrate having a pair of apertures. The substrate further contains a frangible portion encompassing one of the apertures and having a shape that corresponds to an opening left in the substrate after removal of the frangible portion. The identifier enables the shape of the frangible portion to be correlated with the shape of the opening left in the substrate after the frangible portion is separated from the substrate.

Abstract: An identifier for a conduit includes a substrate having a pair of apertures. The substrate further contains a frangible portion encompassing one of the apertures and having a shape that corresponds to an opening left in the substrate after removal of the frangible portion. The identifier enables the shape of the frangible portion to be correlated with the shape of the opening left in the substrate after the frangible portion is separated from the substrate.

Abstract: An identifier for a conduit includes a substrate having a pair of apertures. The substrate further contains a frangible portion encompassing one of the apertures and having a shape that corresponds to an opening left in the substrate after removal of the frangible portion. The identifier enables the shape of the frangible portion to be correlated with the shape of the opening left in the substrate after the frangible portion is separated from the substrate.

Abstract: An identifier for a conduit includes a substrate having a pair of apertures. The substrate further contains a frangible portion encompassing one of the apertures and having a shape that corresponds to an opening left in the substrate after removal of the frangible portion. The identifier enables the shape of the frangible portion to be correlated with the shape of the opening left in the substrate after the frangible portion is separated from the substrate.