Abstract: An electronic assembly that includes a plurality of electronic substrates that are plugged into a polygonal shaped motherboard. The polygonal shape of the motherboard minimizes the electrical path between electronic substrates while providing enough space between adjacent substrates to allow a fluid to sufficiently remove heat generated by integrated circuits of the substrates.

Abstract: An integrated circuit package that receives power from a connector clipped to an edge of the package. The IC package has at least one pair of contact strips that extend along an edge of the package. The strips are connected to the power and ground pads of the integrated circuit by internal routing of the package. The connector has a plurality of conductive spring fingers that clip onto the contact strips of the package. The connector supplies power to the package through a cable connected to an external power supply. The package may have a number of separate connectors that provide different voltage levels to the integrated circuit. The IC package may have a plurality of contacts that extend from the package and are mounted to a printed circuit board.

Abstract: An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

Abstract: An electronic package which has a plurality of stacked integrated circuit dies. The package includes a first die that is mounted to a die paddle of a lead frame. The first die is also connected to the leads of the lead frame by bond wires. A second die is mounted to the top surface of the first die and electrically connected to the first die with bond wires. The first die, second die and die paddle are all enclosed by a package.

Abstract: An electronic package for an integrated circuit (IC). The package has a plurality of first pins extending from a laminated plastic/printed circuit board substrate. The pins are coupled to the integrated circuit and provide a means for mounting the package to an external printed circuit board. The package also has an internal circuit board that is coupled to both the substrate and the IC by a plurality of second pins. Mounted to the circuit board are passive and/or active electrical elements that are connected to the integrated circuit through the second pins. Some of the second pins may extend entirely through the substrate to directly couple the internal circuit board and electrical elements to the external printed circuit board. To improve the thermal impedance of the package, the integrated circuit is mounted to a heat slug which can be attached to a heat sink. The heat sink may also provide a substrate for the internal circuit board.

Abstract: A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux.