Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: Systems and methods are provided for a nested co-blindmate high-density optical switch system. The nested co-blindmate high-density optical switch system can include a system enclosure, and an enclosure midplane that is installed the system enclosure. Further, a switch chassis can be enclosed by the system enclosure, and liquid blindmate to a liquid line on a rack; optically blindmate to at least one blade in the system enclosure; and electrically blindmate to the enclosure midplane. At least one optical switch line-card can be included in the system, which is enclosed by the switch chassis, and further enclosed by the system enclosure in a nested manner. The at least one optical switch line-cards can liquid blindmate to the switch chassis, optically blindmate to the switch chassis, and electrically blindmate to the enclosure midplane.

Abstract: Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.

Abstract: A system and method for remediating and redeploying out of compliance applications and cloud services uses integrated vulnerability information. The system and method may use Conda packages and compliance reports to perform the monitoring, remediation and redeployment.

Abstract: Cold plates are described herein. In one example, a cold plate can include a heat plate bay coupled to a first side and a second side of a coolant channel, a heat plate removably coupled within the heat plate bay, and a gasket coupled to the heat plate to seal the heat plate within the heat plate bay to provide a fluid path between the first side and the second side of the coolant channel.

Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

Abstract: Distributed Bragg reflectors are incorporated into the compositionally graded buffers of metamorphic solar cells, adding functionality to the buffer without adding cost. The reflection aids in collection in subcells that are optically thin due to low diffusion length, high bulk recombination, radiation hardness, partially-absorbing quantum structures, or simply for cost savings. Performance enhancements are demonstrated in GaAs subcells with QWs, which is beneficial when GaAs is not the ideal bandgap.

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

Abstract: Examples herein relate to detecting a coolant leak. For example, a system includes a nanosensor coupled to an airflow channel in a server. The nanosensor provides a resistance measurement to a controller. The system includes the controller coupled to the nanosensor. The controller detects the coolant leak based on the resistance measurement from the nanosensor.

Abstract: The present disclosure relates to a movable rack. For example, the movable rack includes an umbilical connection to deliver a fluid, an electrical current, or a network connection to the movable rack. The present disclosure further relates to the movable rack to include a translating frame to move the umbilical connection to correspond with a movement of the movable rack.

Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.

Abstract: An assembly to detect fluid leaks is provided herein. For example, the assembly includes a plug, a gasket, and a sensor member. The plug is connected to a first electronic module. The gasket surrounds the plug to provide a fluid-tight seal around the plug. The sensor member is connected to the gasket to detect fluid loss that exceeds a predetermined amount.

Abstract: In one implementation, a system for valve failure prediction includes a temperature engine to determine a temperature of a liquid exiting a cooling device, a flowrate engine to compare an actual flow rate of the liquid exiting the cooling device to a flow rate threshold, a prediction engine to determine when a valve of the cooling device is malfunctioning based on the comparison of the actual flow rate and the flow rate threshold, and a notification engine to notify a user when the valve of the cooling device is malfunctioning.

Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.

Abstract: Examples herein disclose a power system including a power distribution unit (PDU) rack and a power module. The PDU rack is positioned in vertically in a server rack to distribute power to the power module. The power module is positioned horizontally in a server rack and includes multiple connectors. The power module is coupled perpendicularly to the PDU rack and receives power cables for delivering power to multiple servers in the server rack.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.

Abstract: According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

Abstract: Tunnel junctions for multijunction solar cells are provided. According to an aspect of the invention, a tunnel junction includes a first layer including p-type AlGaAs, a second layer including n-type GaAs, wherein the second layer is a quantum well, and a third layer including n-type AlGaAs or n-type lattice matched AlGaInP. The quantum well can be GaAs or AlxGaAs with x being more than about 40%, and lattice matched GaInAsNSb in the Eg range of from about 0.8 to about 1.4 eV.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.