Abstract: A semiconductor device includes a device body, a pad and a signal distribution runner. The device body includes a plurality of parallel cells and at least one integrated electronic component. The pad is located on a surface of the device body and includes a first portion and a second portion that are electrically isolated. The signal distribution runner is electrically coupled to and extends from the first portion of the pad. The signal distribution runner provides a signal to a same terminal of each of the plurality of parallel cells. The at least one integrated electronic component is electrically coupled to the second portion of the pad.

Abstract: A semiconductor device includes a device body, a gate pad and a gate signal distribution runner. The device body includes a plurality of parallel cells and the gate pad is located on a top surface of the device body adjacent a corner of the device body. The gate signal distribution runner includes a peripheral gate signal distribution runner extending around the periphery of the device body from the gate pad and a diagonal gate signal distribution runner extending diagonally across the device body from the gate pad. The gate signal distribution runner provides a gate signal to a gate of each of the plurality of parallel cells.

Abstract: An interface for providing thermal overload protection includes a switching device, a temperature indicating device, a drive circuit and a thermal monitoring circuit. The thermal monitoring circuit is coupled across the temperature indicating device and provides a shutdown signal to the drive circuit when the temperature of the switching device is above a predetermined temperature level as indicated by a temperature signal provided by the temperature indicating device. The drive circuit responds to the shutdown signal by removing current sources and current sinks from a control terminal of the switching device at which point leakage currents cause the switching device to reduce a drive current to an inductive load.