Patents by Inventor John G. Arthur

John G. Arthur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper ball bond interface structure and formation
    Patent number: 9257403
    Abstract: An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location (42) under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: February 9, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong, Meijiang Song, Jia Lin Yap, Matthew J. Zapico
  • Copper Ball Bond Interface Structure and Formation
    Publication number: 20150145148
    Abstract: An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location (42) under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong, Meijiang Song, Jia Lin Yap, Matthew J. Zapico