Abstract: A surgical instrument includes a rotatable electrical coupling assembly having a first part and a second part that electrically couple and rotate relative to each other. The second part is carried by and rotates with a tube collar coupled to a transducer. A portion of the transducer is inserted through an aperture of the second part, but does not contact the second part. The first part of the assembly may electrically couple to the second part via pogo pins, brush contacts, or ball bearings. Alternatively, the first part may comprise conductive channels formed in the casing. The second part may comprise a rotatable drum with a conductive trace. In some versions, one or more components may comprise MID components. In another version, the rotatable electrical coupling assembly comprises a rotatable PC board and brush contact. Further still, a circuit board may be provided with the transducer inside a transducer casing.

Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.

Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A process for making a removably interlockable connector assembly that includes a first connector having a head on a mesa and a second connector having an opening that receives the head on the first connector. The head on the mesa of the first connector and the material defining the opening in the second connector are flexible and sized, so that the head on the mesa of the first connector and the material defining the opening in the second connector flex as the head on the mesa of the first connector is inserted into the opening in the second connector. The head on the mesa of the first connector is formed by selectively etching portions of a first pad layer through openings in an etch resistant layer.

Abstract: A removably interlockable connector assembly and process for making the assembly that include a first connector having a head on a mesa and a second connector having an opening that receives the head on the first connector. The head on the first connector and the material defining the opening in the second connector are flexible and sized, so that the head on the first connector and the material defining the opening in the second connector flex as the head on the first connector is inserted into the opening in the second connector.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

Abstract: A particle spacing and metering device having a supply hopper above a pair of contra-rotating rollers. An aperture in the floor of the hopper is provided with a regulator which controls the flow of particles to the rollers. The regulator has a body fixed to a shaft rotatably mounted in the aperture. A cam-type metering face has a groove of increasing depth and width to enable selected variation of a throat through which the particles flow.