Abstract: An improved system of igniting a plasma using a rapid voltage rise and thus causing ions that may be pre-existing to create secondary electron emission or the like is provided. In one embodiment, the voltage rise can be timed to be comparable to the transit time of the electrons across the plasma. It can also be arranged to achieve a voltage rise in less than 1000 microseconds, to result in a transition time that is less than one hundred times the transit time, to maximize the emission of secondary electrons, or even to merely result in collision energies ranging from 5 to 500 electron volts. The transition time can be controlled through an ignition control that may be programmable, may involve charging output storage devices, or may involve delayed switching to supply the increased voltage to the plasma after the storage elements have been more fully charged.

Abstract: Techniques for removing an electrical short caused by a flake in a thin film sputtering system are disclosed. The flake typically bridges the dark space between target and anode or shield and is removed through manipulation of the power supply utilized for normal operations. Sensing of the flake and discrimination between recoverable arcs is accomplished by timing the duration of an over-current condition. Removal involves switching between power mode or some other initial mode of regulation and current modes and progressively increasing current to melt the flake. Circuitry automatically removes the flake and is easily adapted to power supplies particularly more sophisticated, high frequency, lower energy storage DC supplies.

Abstract: Techniques for removing an electrical short caused by a flake in a thin film sputtering system are disclosed. The flake typically bridges the dark space between target and anode or shield and is removed through manipulation of the power supply utilized for normal operations. Sensing of the flake and discrimination between recoverable arcs is accomplished by timing the duration of an over-current condition. Removal involves switching between power mode or some other initial mode of regulation and current modes and progressively increasing current to melt the flake. Circuitry automatically removes the flake and is easily adapted to power supplies particularly more sophisticated, high frequency, lower energy storage DC supplies.

Abstract: Techniques for recovery from a low impedance conditions during cathodic arc or electric vapor thin film processes are disclosed. Sensing of a low impedance condition is achieved followed automatically by active clearing of the cloud to return it to the proper impedance or resistance state. Active clearing is accomplished by a progressive increase in the output of bias voltage supply. Regulation of the bias voltage supply switches between voltage or power modes and a current mode of regulation. Circuitry disclosed is designed to readily modify existing power supplies to achieve the methods discussed and to linearly increase the current output by it.