Patents by Inventor John G. Spadafora

John G. Spadafora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bumping silicon devices
    Patent number: 5505367
    Abstract: The bonding pads (18) of a semiconductor chip (12) each may be provided with a solder bump (36) by first screen printing a pattern of solder paste (36) on a heat-resistant, non-wettable surface (24). The chip (12) is then placed on the surface (24) so each bonding pad (18) contacts a portion of the solder paste pattern (36). The solder paste is then reflowed, yielding molten solder that bonds to the bonding pads (18) of the chip, but not to the surface (24). After reflow, the chip, with its now-bumped pads, is removed from the surface for subsequent soldering to a wettable substrate.
    Type: Grant
    Filed: November 2, 1994
    Date of Patent: April 9, 1996
    Assignee: AT&T Corp.
    Inventors: Yinon Degani, Thomas D. Dudderar, John G. Spadafora