Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An apparatus for positioning service element interface devices is provided. A gate is affixed to a computing rack by a gate hinge that rotates on a first axis. A tray is affixed to the gate. The tray has a first side and a second side that are opposite exterior surfaces of the tray. A first display and a first keyboard are affixed to the first side. A second display and a second keyboard are affixed to the second side. The first keyboard and the first display provide a first interface that is redundant with a second interface provided by the second keyboard and the second display.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An apparatus for positioning service element interface devices is provided. A gate is affixed to a computing rack by a gate hinge that rotates on a first axis. A tray is affixed to the gate. The tray has a first side and a second side that are opposite exterior surfaces of the tray. A first display and a first keyboard are affixed to the first side. A second display and a second keyboard are affixed to the second side. The first keyboard and the first display provide a first interface that is redundant with a second interface provided by the second keyboard and the second display.

Abstract: An apparatus for positioning service element interface devices is provided. A gate is affixed to a computing rack by a gate hinge that rotates on a first axis. A tray is affixed to the gate. The tray has a first side and a second side that are opposite exterior surfaces of the tray. A first display and a first keyboard are affixed to the first side. A second display and a second keyboard are affixed to the second side. The first keyboard and the first display provide a first interface that is redundant with a second interface provided by the second keyboard and the second display.

Abstract: An apparatus is provided which includes a changeable cover assembly sized to cover, at least in part, an air outlet side of an electronics rack. The cover assembly, when positioned at the air outlet side of the rack, redirects and vents airflow egressing from the air outlet side. The cover assembly includes a frame and at least one vent cover. The frame has at least one opening through which air egressing from the electronics rack passes, and the vent cover(s) is coupled to the frame and overlies, at least in part, the opening(s) in the frame to facilitate redirecting and venting the air passing through the frame. The at least one vent cover is changeable to change a direction of the vented air. For instance, the vent cover(s) may be reversible, or otherwise adjustable or changeable, to change the direction of vented air egressing from the cover assembly.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.

Abstract: Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

Abstract: Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.

Abstract: A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.

Abstract: A tool and technique are employed to distill and prioritize multiple organizational (sub-system) capabilities based on ranked customer requirements or desires. A translational matrix is employed to organize preferences of the sub-system with respect to the customer requirements or desires. Relative importance scores are input into the matrix to reflect prioritized input versus prioritized capabilities. An adjusted relative importance score of the sub-system is automatically calculated and a resultant re-prioritization of sub-system attributes is created for application to new designs, services, or processes.

Abstract: A quantitative approach to analytically assess technical elements within a system design. Numerical analysis and sorting is performed across the technical elements. Risk analysis is performed by evaluating criteria and ranking the evaluated criteria. The ranking criteria are placed into groups, with the groups identifying area that will be mitigated against risk.

Abstract: A tool and technique are employed to distill and prioritize multiple organizational (sub-system) capabilities based on ranked customer requirements or desires. A translational matrix is employed to organize preferences of the sub-system with respect to the customer requirements or desires. Relative importance scores are input into the matrix to reflect prioritized input versus prioritized capabilities. An adjusted relative importance score of the sub-system is automatically calculated and a resultant re-prioritization of sub-system attributes is created for application to new designs, services, or processes.