Patents by Inventor John G. TWOMBLY
John G. TWOMBLY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230307321Abstract: Structures for a through-silicon via and methods of forming a structure for a through-silicon via. The structure includes a substrate having a trench and surfaces that border the trench. The structure further includes a through-silicon via having a layer inside the trench. The layer is in direct contact with the surfaces of the substrate.Type: ApplicationFiled: March 28, 2022Publication date: September 28, 2023Inventors: David Thomas, Cody Soule, John G. Twombly, Michael Brigham, Bruce Porth, Vivekanand Kalaparthi
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Patent number: 11174160Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: August 17, 2016Date of Patent: November 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Patent number: 11111138Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: September 24, 2019Date of Patent: September 7, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Patent number: 10618802Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: July 23, 2018Date of Patent: April 14, 2020Assignee: International Business Machines CorporationInventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20200017355Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: September 24, 2019Publication date: January 16, 2020Inventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20180346318Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: July 23, 2018Publication date: December 6, 2018Inventors: Anthony K. Stamper, John G. Twombly
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Patent number: 10081540Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: November 9, 2017Date of Patent: September 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Patent number: 10005661Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: July 20, 2016Date of Patent: June 26, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20180072568Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: November 9, 2017Publication date: March 15, 2018Inventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20160355392Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: August 17, 2016Publication date: December 8, 2016Inventors: Anthony K. Stamper, John G. Twombly
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Patent number: 9493341Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: April 23, 2013Date of Patent: November 15, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20160325986Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: July 20, 2016Publication date: November 10, 2016Inventors: Anthony K. Stamper, John G. Twombly
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Patent number: 9406472Abstract: Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.Type: GrantFiled: December 21, 2010Date of Patent: August 2, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Dinh Dang, Thai Doan, George A. Dunbar, III, Zhong-Xiang He, Russell T. Herrin, Christopher V. Jahnes, Jeffrey C. Maling, William J. Murphy, Anthony K. Stamper, John G. Twombly, Eric J. White
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Patent number: 8878326Abstract: Structures and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.Type: GrantFiled: February 5, 2013Date of Patent: November 4, 2014Assignee: International Business Machines CorporationInventors: Edward C. Cooney, III, Jeffrey P. Gambino, Robert K. Leidy, Charles F. Musante, John G. Twombly
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Publication number: 20130234265Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: April 23, 2013Publication date: September 12, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. Stamper, John G. Twombly
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Patent number: 8476099Abstract: Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.Type: GrantFiled: July 22, 2010Date of Patent: July 2, 2013Assignee: International Business Machines CorporationInventors: Edward C. Cooney, III, Jeffrey P. Gambino, Robert K. Leidy, Charles F. Musante, John G. Twombly
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Patent number: 8458888Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: GrantFiled: December 20, 2010Date of Patent: June 11, 2013Assignee: International Business Machines CorporationInventors: Anthony K. Stamper, John G. Twombly
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Publication number: 20120018832Abstract: Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.Type: ApplicationFiled: July 22, 2010Publication date: January 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edward C. COONEY, III, Jeffrey P. GAMBINO, Robert K. LEIDY, Charles F. MUSANTE, John G. TWOMBLY
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Publication number: 20110315527Abstract: Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.Type: ApplicationFiled: December 21, 2010Publication date: December 29, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dinh DANG, Thai DOAN, George A. DUNBAR, III, Zhong-Xiang HE, Russell T. HERRIN, Christopher V. JAHNES, Jeffrey C. MALING, William J. MURPHY, Anthony K. STAMPER, John G. TWOMBLY, Eric J. WHITE
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Publication number: 20110314669Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.Type: ApplicationFiled: December 20, 2010Publication date: December 29, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony K. STAMPER, John G. TWOMBLY