Patents by Inventor John G. Wistey

John G. Wistey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High speed flip chip assembly process
    Publication number: 20040026033
    Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.
    Type: Application
    Filed: August 7, 2003
    Publication date: February 12, 2004
    Inventors: David M. Price, Christopher J. Piacitelli, Gary R. Larson, Shaun Huot, James S. Hammond, Miaoyong Cao, Bruce P. Mahan, John G. Wistey
  • High speed flip chip assembly process
    Publication number: 20020020491
    Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.
    Type: Application
    Filed: April 4, 2001
    Publication date: February 21, 2002
    Inventors: David M. Price, Christopher J. Piacitelli, Gary R. Larson, Shaun Huot, James S. Hammond, Miaoyong Cao, Bruce P. Mahan, John G. Wistey