Abstract: The present invention relates to dual curing compositions, which cure with moisture and photo radiation, such as UV light, and methods for preparing and using same. In particular, the compositions of the present invention contain a polyether or polyester backbone, photocurable portion(s) and moisture curable portion(s). The photo curable portion is a urethane or carbamate linkage terminated with a (meth)acryloxyalkyl group. The moisture curable portion is either: (1) a portion terminated with a polyalkoxysilyl group; or (2) a portion having a urea linkage terminated with an alkylpolyalkoxysilyl group.

Abstract: A method of conducting controlled radical polymerization, including: (a) providing a mixture of at least one monomer; at least one monomer solvent; at least one compound metal coordinating capable; and at least one initiator; (b) directing the mixture at a rate over a solid catalyst surface contained in an external chamber to the vessel, the catalyst including a metal or metal compound capable of at least two oxidation states; (c) monitoring the reaction vessel temperature; (d) adjusting the flow rate when the temperature is outside a selected temperature range; and (e) allowing the polymerization to proceed to desired conversion level.

Abstract: The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired.

Abstract: The present invention relates to anaerobically curable compositions based on (meth)acrylate-functionalized poly(acrylate) polymers.

Abstract: The present invention relates to liquid stable thiol-acrylate and thiol-vinyl ether compositions. More particularly, in accordance with some embodiments, the compositions may include a (meth)acrylate, a thiol component, an organic acid stabilizer, and a curing initiator. In other embodiments, the compositions may include a curable component selected from a (meth)acrylate, vinyl ether and/or alkenyl ether, a reactive diluent having vinyl ether and acrylate functionality, a thiol component and a stabilizer selected from an organic acid, a hemiacetal ester derivative of an organic acid and/or a phenol acetal.

Abstract: The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: The present invention is directed to acrylated urethanes including the reaction product of: (1)(a) at least one urethane having at least two isocyanate groups and at least one acrylate group; and (b) at least one alcohol compound having at least two hydroxyl groups; or (2) (a) at least one isocyanate functional urethane which is the reaction product of at least one alcohol compound selected from the group consisting of amino alcohols, thioether alcohols, phosphino alcohols and mixtures thereof and at least one polyisocyanate; and (b) at least one hydroxy-functional material having at least one acrylate group; curable compositions including the same and processes for making the same.

Abstract: A fuel cell, having improved sealing against leakage, includes a fuel cell component having a cured sealant, wherein the cured sealant includes a telechelic-functional polyisobutylene, an organhydrogenosilane crosslinker, a platinum catalyst and a photoinitiator. The fuel cell component may be a cathode flow field plate, an anode flow field plate, a resin frame, a gas diffusion layer, an anode catalyst layer, a cathode catalyst layer, a membrane electrolyte, a membrane-electrode-assembly frame, and combinations thereof.

Abstract: A fuel cell, having improved sealing against leakage, includes a sealant disposed over the peripheral portions a membrane electrode assembly such that the cured sealant penetrates a gas diffusion layer of the membrane electrode assembly. The sealant is applied through liquid injection molding techniques to form cured sealant composition at the peripheral portions of the membrane electrode assembly. The sealant may be thermally cured at low temperatures, for example 130° C. or less, or may be cured at room temperature through the application of actinic radiation. The sealant may be a one-part or a two-part sealant. The sealant includes a polymerizable material, such as a polymerizable monomer, oligomer, telechelic polymer, functional polymer and combinations thereof functionalized with a group selected from epoxy, allyl, vinyl, (meth)acrylate, imide, amide, urethane and combinations thereof.

Abstract: The present invention relates to vinyl ether or acrylate terminated block resins, compositions incorporating same and methods for preparing same. In particular, the compositions of the present invention may contain a vinyl ether or acrylate terminated block resin, such as a polyurethane block copolymer, a reactive diluent having vinyl ether or 1-alkenyl ether and (meth)acrylate functionality and a curing initiator. The compositions may be exposed to an energy source, e.g., photoradiation, to impart tack-free surface cure.

Abstract: The present invention relates to a process for hydroxyalkylating terminal carboxylic acid groups. More specifically, this invention provides a process for preparing hydroxyl-functionalized materials, such as butadiene nitrile polymers, from carboxylic acid-functionalized materials, such as butadiene nitrile polymers, using a carbocyclic carbonate, such as ethylene carbonate, or a carbocyclic sulfite, such as ethylene sulfite.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification.

Abstract: In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.

Abstract: Adhesive compositions are disclosed which include acrylates, their polymers, and free radical initiators. The compositions include a multi-functional alpha-alkoxyalkyl (meth)acrylate compound and a free radical initiator. The multi-functional alpha-alkoxyalkyl (meth)acrylate compound is the reaction product of: (a) a (meth)acrylic acid or a (meth)acrylate ester having a free carboxylic acid group; and (b) a compound including two or more 1-alkenyl ether groups and free of acetal and ketal groups, or a compound free of acetal and ketal groups and including one or more 1-alkenyl ether groups and a (meth)acrylate group. The compositions are easier and less expensive to prepare than conventional acrylate compositions and degrade when contacted with an acid medium or when heated. The compositions are useful in a wide range of applications and are compatible with conventional adhesive additives.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak ?-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.