Patents by Inventor John Gardner Bloomsburgh
John Gardner Bloomsburgh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9856132Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.Type: GrantFiled: September 18, 2011Date of Patent: January 2, 2018Assignee: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Patent number: 9586813Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.Type: GrantFiled: July 21, 2015Date of Patent: March 7, 2017Assignee: FAIRCHILD SEMICONDUCTOR CORPORATIONInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Patent number: 9352961Abstract: An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion.Type: GrantFiled: September 16, 2011Date of Patent: May 31, 2016Assignee: Fairchild Semiconductor CorporationInventors: Cenk Acar, John Gardner Bloomsburgh
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Publication number: 20150321904Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.Type: ApplicationFiled: July 21, 2015Publication date: November 12, 2015Inventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Patent number: 9156673Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.Type: GrantFiled: September 18, 2011Date of Patent: October 13, 2015Assignee: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Patent number: 9095072Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.Type: GrantFiled: September 16, 2011Date of Patent: July 28, 2015Assignee: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Patent number: 9062972Abstract: This document discusses, among other things, an inertial sensor including a single proof-mass formed in an x-y plane of a device layer, the single proof-mass including a single, central anchor configured to suspend the single proof-mass above a via wafer. The inertial sensor further includes first and second electrode stator frames formed in the x-y plane of the device layer on respective first and second sides of the inertial sensor, the first and second electrode stator frames symmetric about the single, central anchor, and each separately including a central platform and an anchor configured to fix the central platform to the via wafer, wherein the anchors for the first and second electrode stator frames are asymmetric along the central platforms with respect to the single, central anchor.Type: GrantFiled: January 31, 2012Date of Patent: June 23, 2015Assignee: Fairchild Semiconductor CorporationInventors: Cenk Acar, John Gardner Bloomsburgh
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Patent number: 9006846Abstract: This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.Type: GrantFiled: September 20, 2011Date of Patent: April 14, 2015Assignee: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Publication number: 20130341737Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit.Type: ApplicationFiled: September 18, 2011Publication date: December 26, 2013Applicant: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Publication number: 20130298671Abstract: An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion.Type: ApplicationFiled: September 16, 2011Publication date: November 14, 2013Applicant: Fairchild Semiconductor CorporationInventors: Cenk Acar, John Gardner Bloomsburgh
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Publication number: 20130277773Abstract: This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon.Type: ApplicationFiled: September 20, 2011Publication date: October 24, 2013Applicant: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Publication number: 20130270660Abstract: One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.Type: ApplicationFiled: September 18, 2011Publication date: October 17, 2013Applicant: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Publication number: 20130250532Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.Type: ApplicationFiled: September 16, 2011Publication date: September 26, 2013Applicant: Fairchild Semiconductor CorporationInventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar
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Publication number: 20130192369Abstract: This document discusses, among other things, an inertial sensor including a single proof-mass formed in an x-y plane of a device layer, the single proof-mass including a single, central anchor configured to suspend the single proof-mass above a via wafer. The inertial sensor further includes first and second electrode stator frames formed in the x-y plane of the device layer on respective first and second sides of the inertial sensor, the first and second electrode stator frames symmetric about the single, central anchor, and each separately including a central platform and an anchor configured to fix the central platform to the via wafer, wherein the anchors for the first and second electrode stator frames are asymmetric along the central platforms with respect to the single, central anchor.Type: ApplicationFiled: January 31, 2012Publication date: August 1, 2013Inventors: Cenk Acar, John Gardner Bloomsburgh
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Patent number: 8006557Abstract: A method and apparatus for sensing accelerations directed along multiple directions are provided. An embodiment comprises a sensor array comprising two sensor pairs, each of which provides an output signal based on acceleration along two orthogonal directions. The sensor pairs are so that they collectively provide an output signal for each of three mutually orthogonal directions. In some embodiments, the sensor array is augmented to provide three additional signals, each of which is based on rotation about an axis aligned with one of the three orthogonal directions.Type: GrantFiled: February 13, 2008Date of Patent: August 30, 2011Assignee: IntelliSense Software CorporationInventors: Luzhong Yin, Sandeep Akkaraju, John Gardner Bloomsburgh, Yie He
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Publication number: 20080282801Abstract: A method and apparatus for sensing accelerations directed along multiple directions are provided. An embodiment comprises a sensor array comprising two sensor pairs, each of which provides an output signal based on acceleration along two orthogonal directions. The sensor pairs are so that they collectively provide an output signal for each of three mutually orthogonal directions. In some embodiments, the sensor array is augmented to provide three additional signals, each of which is based on rotation about an axis aligned with one of the three orthogonal directions.Type: ApplicationFiled: February 13, 2008Publication date: November 20, 2008Applicant: INTELLISENSE SOFTWARE CORPORATIONInventors: Luzhong Yin, Sandeep Akkaraju, John Gardner Bloomsburgh, Yie He