Patents by Inventor John Gillette Davis
John Gillette Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7150096Abstract: A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of horizontal arms along different axes over a circuit board. Compressed air is supplied simultaneously to each of the cylinders, and the cylinders force the component onto a bonding position on the circuit board. The method permits heat sinks to be pressed against components located on the circuit board to bond the heat sinks to the components.Type: GrantFiled: July 19, 2000Date of Patent: December 19, 2006Assignee: International Business Machines Corp.Inventors: James Westcott Heater, Allen Thomas Mays, John Gillette Davis
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Patent number: 6471117Abstract: A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.Type: GrantFiled: November 4, 1999Date of Patent: October 29, 2002Assignee: International Business Machines CorporationInventors: John Gillette Davis, Allen Thomas Mays, Kris Allen Slesinger
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Patent number: 6437254Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: GrantFiled: August 24, 2001Date of Patent: August 20, 2002Assignee: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi
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Publication number: 20020059721Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: ApplicationFiled: August 24, 2001Publication date: May 23, 2002Applicant: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi
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Patent number: 6295724Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: GrantFiled: October 28, 1999Date of Patent: October 2, 2001Assignee: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi
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Patent number: 6296173Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.Type: GrantFiled: January 3, 2001Date of Patent: October 2, 2001Assignee: International Business Machines CorporationInventors: John Gillette Davis, Joseph Michael Kielbasa
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Publication number: 20010000905Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.Type: ApplicationFiled: January 3, 2001Publication date: May 10, 2001Inventors: John Gillette Davis, Joseph Michael Kielbasa
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Patent number: 6196444Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads.Type: GrantFiled: March 30, 1999Date of Patent: March 6, 2001Assignee: International Business Machines CorporationInventors: John Gillette Davis, Joseph Michael Kielbasa
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Patent number: 6141866Abstract: A multiple force tool for applying pressure to circuit components during a manufacturing operation. A plurality of compressed air pressure cylinders are supported on a plurality of horizontal arms over a circuit board. A pressure foot of each compressed air pressure cylinder is extendable when an air controller foot switch is depressed. Positioning of each of the cylinders is afforded along two axes, so that the cylinders may be positioned over components which are to be pressed against the circuit board. Heat sinks may be pressed against components located on the circuit board to bond the heat sinks to the components.Type: GrantFiled: February 25, 1998Date of Patent: November 7, 2000Assignee: International Business Machines CorporationInventors: James Westcott Heater, Allen Thomas Mays, John Gillette Davis
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Patent number: 6115912Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: GrantFiled: October 28, 1999Date of Patent: September 12, 2000Assignee: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi
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Patent number: 6039805Abstract: A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.Type: GrantFiled: January 12, 1998Date of Patent: March 21, 2000Assignee: International Business Machines CorporationInventors: John Gillette Davis, Allen Thomas Mays, Kris Allen Slesinger
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Patent number: 6018866Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: GrantFiled: February 13, 1998Date of Patent: February 1, 2000Assignee: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi
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Patent number: 5924622Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.Type: GrantFiled: July 17, 1996Date of Patent: July 20, 1999Assignee: International Business Machines Corp.Inventors: John Gillette Davis, Joseph Michael Kielbasa
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Patent number: 5809641Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.Type: GrantFiled: April 25, 1996Date of Patent: September 22, 1998Assignee: International Business Machines CorporationInventors: Alan Harris Crudo, John Gillette Davis, Christian Robert Le Coz, Mark Vincent Pierson, Amit Kumar Sarkhel, Ajit Kumar Trivedi