Patents by Inventor John Glasko

John Glasko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vacuum chuck with polymeric embossments
    Patent number: 10734270
    Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: August 4, 2020
    Assignee: ENTEGRIS, INC.
    Inventors: John Glasko, Richard A. Cooke, I-Kuan Lin
  • Vacuum Chuck with Polymeric Embossments
    Publication number: 20150380294
    Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
    Type: Application
    Filed: February 11, 2014
    Publication date: December 31, 2015
    Inventors: John Glasko, Richard A. Cooke, I-Kuan Lin