Patents by Inventor John H. Abbott

John H. Abbott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making plastic package for a surface mounted integrated circuit
    Patent number: 5976914
    Abstract: In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package (10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: November 2, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: John H. Abbott, Navinchandra Kalidas, Raymond W. Thompson
  • Plastic packaging for a surface mounted integrated circuit
    Patent number: 5777382
    Abstract: In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package(10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: July 7, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: John H. Abbott, Navinchandra Kalidas, Raymond W. Thompson
  • Intelligent electronic connection socket
    Patent number: 4540226
    Abstract: An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the body. The electronic device includes several bonding pads. The socket includes a set of pins to provide interconnection to external electronic devices. The body also includes pin sockets providing interconnection to the electronic package. The pins and pin sockets of the body are also connected to the bonding pads of the electronic device. To provide the electrical interconnection between the electronic package, the electronic device located upon the semiconductor substrate in the socket body and the external circuitry connected to the body.
    Type: Grant
    Filed: January 3, 1983
    Date of Patent: September 10, 1985
    Assignee: Texas Instruments Incorporated
    Inventors: Raymond W. Thompson, Navinchandra Kalidas, John H. Abbott, David S. Laffitte