Abstract: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

Abstract: The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of:A. providing a green electronic component;B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component;C. placing the green electronic component in the opening in the stack to form a structure; andD. laminating and firing the structure so as to provide the monolithic electronic structure.

Abstract: The present invention provides a method for making an insulated electrical heating element such as for domestic appliances to heat water, etc. wherein a resistive track is embedded in a dielectric ceramic insulating material. The method includes the steps of providing a rigid base plate; printing a resistive track on one surface of a segment of flexible tape comprising fusible ceramic particles in an organic binder; adhering the other surface of the tape segment to a surface of a base plate; and placing a second segment of flexible tape of the same type on the surface with the resistive track printed thereon. Then the resulting assembly is fired to fuse the ceramic particles of the tape segments and provide a ceramic layer on the base plate with an electrical resistive track insulated therewithin.

Abstract: The present invention provides a method for making a ceramic article having a cavity therein and at least one shelf portion protruding laterally into the cavity spaced from the cavity floor comprising the steps of constructing a laminated product using strips of tape comprising fusible ceramic particles and a binder, said strips being cut to predetermined dimensions and superposed so as to define a cavity with a floor and side walls, and with at least one horizontal shelf portion extending from a side wall into said cavity, the shelf portion being spaced above the floor; filling said cavity with a fugitive insert of multiple strips of tape to support the shelf portion; and firing the laminated product to fuse the particles and to burn off the fugitive insert to provide a ceramic article with a cavity and a shelf parallel to the cavity floor.

Abstract: The present invention provides a new and useful via fill paste for use in the construction of electronic circuit devices. The unique via fill paste is capable of electrically connecting conductive layers made of dissimilar metals such as gold and silver. The via fill paste includes gold, silver, palladium and a refractory oxide. The refractory oxide comprises one or more metals selected from the group consisting of zirconium, yttrium, niobium, tantalum, lanthanum, thorium, hafnium, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium.

Abstract: The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.

Abstract: The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.

Abstract: A dielectric composition comprising a base of non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate, lead zirconate, titanium dioxide and bismuth titanate, together with a further oxide additive, in particular nickel oxide, manganese oxide, cobalt oxide or a rare earth, has a low firing temperature (900.degree.-1000.degree. C.), high dielectric constant (up to 14,750), low tan .delta.(<2.5% at 20.degree. C.) and Z5U temperature coefficient of capacitance.

Abstract: A dielectric composition including a ternary system comprising non-stoichiometric lead magnesium niobate, non-stoichiometric lead zinc niobate and non-stoichiometric lead iron niobate, and a small amount of one or more oxide additives which serves to reduce the tan .delta. value in comparison with the ternary system alone. The one or more additives may be chosen from the group consisting of nickel oxide, stoichiometric lead nickel niobate, ceric oxide, lead oxide, zirconium oxide, silver oxide, manganese dioxide, lanthanum oxide and cobalt oxide. Compositions with firing temperatures in the range 950.degree. to 1100.degree. C. have dielectric constants in the range 10700 to 16600 (at 20.degree. C.) making the composition particularly useful for high silver content multilayer ceramic capacitors.

Abstract: Ceramic capacitors are formed from electrodeposited ceramic dielectric layers that are provided with electrodes, stacked and fired. Contact to the electrodes is provided by each terminations and leads. As the electrodeposition process is self limiting and self heating, uniform pinhole free dielectric layers are obtained.

Abstract: A dielectric composition, for use in the manufacture of ceramic capacitors, and comprised of barium titanate (BaTiO.sub.3) with small additions of niobium pentoxide (Nb.sub.2 O.sub.5) and gadolinium sesquioxide (Gd.sub.2 O.sub.3).

Abstract: A method of manufacturing thin film dielectric material by directing vapors of reactants containing lead and additional metals and an oxidizing gas onto a heated substrate to form a layer of dielectric material thereon, which layer can be of a high dielectric constant (greater than 5000).

Abstract: Ceramic capacitors are made by printing green ceramic limps with a fugitive electrode material, stacking the printed limps and firing the stacked assembly to form the ceramic and remove the fugitive electrodes. This provides an array of laminar voids in the body. The ceramic is doped to form boundary layers, terminations are applied, and the voids are then filled, such as by vacuum impregnation, with an electrode metal.

Abstract: A multilayer ceramic dielectric capacitor comprises a plurality of layers of dielectric arranged in a stack. Between the dielectric layers are arranged metallic electrodes. Alternate electrodes in the stack extend to opposite end faces thereof, where they are electrically connected by end terminations. The electrodes each comprise a plurality of parallel conductive elements provided between two adjacent dielectric layers. The adjacent dielectric layers are bonded together along three of their edges and at the gaps between the conductive elements, thus providing a stronger structure than when the adjacent layers are only bonded at the three of their edges. The electrode pattern comprised by a plurality of parallel elements is particularly applicable to metal-impregnated ceramic dielectric capacitors, which employ fugitive electrodes that are burnt away during firing of the ceramic to leave spaces for subsequent metal impregnation.

Abstract: End terminations for multilayer ceramic dielectric capacitors, particularly but not exclusively metal-impregnated capacitors, are provided by bonding a coarse ceramic powder, which is lightly coated with silver, to the capacitor ceramic by means of a glass frit in order to produce a porous pseudo end termination containing insufficient silver to provide a good contact to the capacitor electrodes. The exposed silver in the pseudo end termination is then provided with a silver sulphide layer and subsequently the pseudo end termination is impregnated with lead. The end termination thus formed is comprised substantially of lead, which is held in place by the silver sulphide layer, that is wetted by the lead, on the bonded ceramic powder, and thus low cost and readily solderable.

Abstract: Conductive and porous end terminations for metal-impregnated multilayer ceramic dielectric capacitors are provided by firing a silver, or silver alloy, and glass frit onto respective end regions of a sintered capacitor stack. The exposed silver of the fired terminations is provided with a silver sulphide layer, the latter being a good electrical conductor and acting as a barrier between the silver and the impregnation metal, for example lead, during a subsequent impregnation step, whereby to prevent leaching of the silver. The termination is readily solderable by virtue of the silver sulphide layer being wetted by the lead during the impregnation step and resulting in a lead coating in the termination.

Abstract: Non-foaming cement compositions comprising a hydraulic cement, a low density filler, water, an organic polyisocyanate and an isocyanate-reactive organic compound, the said composition, containing by weight, 10 to 10,000 parts of filler, 10 to 75 parts of water and 11 to 5,000 parts of an organic polyisocyanate and isocyanate-reactive organic compound taken together per 100 parts of hydraulic cement, the polyisocyanate being used in excess with respect to the isocyanate-reactive compound for reaction with the water and the total amount polyisocyanate and isocyanate-reactive organic compound being greater than the amount of water present. These compositions set rapidly and provide strong, durable flooring surfaces.