Abstract: A glove dispensing system wherein there are a pair of tines which are adapted to be attached to, laterally spaced, and project laterally outwardly from a support. A plurality of gloves, each of which has a peripherally extending cuff forming a back wall and a front wall, the back wall having laterally spaced perforations which allow the gloves to be fitted over the tines, the back wall and front wall cooperating to form a mouth into the gloves such that a user's hand can be inserted into the gloves with a minimal amount of manual manipulation.

Abstract: Provided may be a wind propelled rolling vehicle with a self-adjusting sail that may be substantially formed in a relatively small, single sheet of material, or assembled onto a standard chassis. The exemplary embodiments may utilize bushings to spread dynamic loads so as to allow the use of very light structural material such as thin sheet foam thereby forming a safe, low-mass toy vehicle capable of achieving good acceleration and rolling speed relative to a given wind force, and configurable into many themes.

Abstract: Embodiments disclosed herein may include a toy method and system configured to be displaced for generally long distances by a small force. The disc-like or ring-like device may utilize wind-related vortex forces to remain generally upright and moving for long distances. Furthermore, the system may comprise an aperture, and may have a aerodynamic configuration to achieve the movement and/or provide for use as a flying disc. The ring-like device may be configured as an annular wing having a symmetrical airfoil configuration and as such may be used both as a wind-driven rolling toy and as a hand-tossed flying ring.

Abstract: The present invention encompasses a process for producing synthetic hydrocarbon products in a reactor. The focus of the present invention is on a novel filtering system for separating synthetic hydrocarbon products from catalyst within the reactor. The filtering system of the present invention could also be used for a variety of similar processes where it is desirable to separate a solid from a liquid within the solid/liquid mixture. Finally, the present invention discloses a novel filter and a method for making the filter.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: The present invention encompasses a process for producing synthetic hydrocarbon products in a reactor. The focus of the present invention is on a novel filtering system for separating synthetic hydrocarbon products from catalyst within the reactor. The filtering system of the present invention could also be used for a variety of similar processes where it is desirable to separate a solid from a liquid within the solid/liquid mixture. Finally, the present invention discloses a novel filter and a method for making the filter.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas having a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid including water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas including a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A technique for cleaning a hard disk using a novel support device 502. The technique includes immersing a disk in a liquid comprising water. The disk has a front face, a back face, an edge, and a center region. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the disk.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: Apparatus for cleaning and drying a semiconductor wafer. The apparatus includes a vessel adapted to immerse a partially completed semiconductor wafer in a liquid comprising water. The apparatus also includes a control valve operably coupled to the vessel through a drain, and adapted to allow a gaseous mixture to displace the liquid in the vessel, where the liquid is displaced adjacent to the front face of the partially completed wafer. A controller is included. The controller is operably coupled to a plurality of nozzles. The controller can be used to pulse a drying fluid from the plurality of nozzles to the partially completed wafer to remove a possibility of liquid which may be attached to the partially completed wafer.

Abstract: A method operates a system for wet processing of semiconductors. The system includes an inlet coupled to a fluid source, and a filter coupled to the inlet. The system also includes a sealed vessel coupled to the filter where the sealed vessel has a lower liquid portion and an upper vapor portion. The system further includes an outlet coupled to the sealed vessel. The outlet is attached to the lower liquid portion. A solvent injector coupled to the sealed vessel is also used. The solvent injector is coupled to the upper vapor portion, and supplies a gaseous mixture including a polar organic compound. The polar organic compound is a non-saturated polar organic vapor. The system also includes a gas source coupled to the sealed vessel. The gas source is coupled to the upper vapor portion, and supplies an inert gas into the upper vapor portion. A device for removing the liquid from the lower liquid portion at substantially a constant liquid level rate is also included.

Abstract: A method for drying articles with flat surfaces such as a semiconductor wafer. The method includes steps of immersing a semiconductor wafer in a liquid such as water, and displacing the liquid with a gaseous mixture. The liquid is displaced adjacent to a face of the wafer as measured from the face. A step of pulsing drying fluid directed at wafer edges is also included. The method dries wafers without the use of any harmful organic solvents and the like, and also dries wafers without substantial movement.

Abstract: A separable heat pipe assembly for stabilizing the generally frozen soil adjacent and supporting a structural member or foundation in permafrost or similar regions, including a cooperative combination of a tubular structure installed in a permafrost environment, a heat pipe element having its lower portion installed in the structure and positioned at least in proximity longitudinally to the wall of the structure, and soil or other substance filling the space remaining between the lower element portion and the structure wall. The upper portion of the heat pipe element has a thicker wall than its lower portion and can be provided with threads thereon. A sleeve-type radiator can be provided with complementary threads therein so that the radiator can be threadedly engaged to the upper element portion. The depth and pitch of the threads can be changed to vary the heat transfer surface area obtainable between the engaged radiator and upper element portion.

Abstract: An inverted L-shaped metal strip bracket member hangs from an upper window trim board or the like and has a plurality of vertically spaced elongated horizontal slots within the lower end permitting a second metal strip hanger bar to be insertably received within one of the slots with one portion facing inwardly of the bracket in contact with the bottom of the window frame while the other portion projects outwardly of the bracket for suspending a flower pot at its outer end.