Patents by Inventor John H. Bean, Jr.
John H. Bean, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11725974Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.Type: GrantFiled: May 23, 2022Date of Patent: August 15, 2023Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: John H. Bean, Jr., Cory D. Basden
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Publication number: 20230247802Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.Type: ApplicationFiled: August 20, 2020Publication date: August 3, 2023Inventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
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Publication number: 20220283014Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.Type: ApplicationFiled: May 23, 2022Publication date: September 8, 2022Inventors: John H. Bean, JR., Cory D. Basden
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Patent number: 11359955Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.Type: GrantFiled: July 16, 2020Date of Patent: June 14, 2022Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: John H. Bean, Jr., Cory D. Basden
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Patent number: 11268739Abstract: A condenser (404) configured to condense gas phase refrigerant to liquid phase refrigerant. The condenser (404) includes a gas header (408) configured to receive gas phase refrigerant, a liquid header (410) disposed opposite the gas header, the liquid header (410) separated into at least two sections, each section of the at least two sections having a port, and parallel tubes (406) extending between the gas header (408) and the liquid header (410).Type: GrantFiled: January 12, 2018Date of Patent: March 8, 2022Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Jinhui Wang, John H. Bean, Jr., Hongwei Yang
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Publication number: 20210266733Abstract: Aspects of the disclosure include a peripheral device comprising at least one light-emitting device, a wireless communication interface, and at least one controller configured to receive a wireless connection request at the wireless communication interface, generate a secret value responsive to receiving the wireless connection request, control the light-emitting device to output a signal indicative of the secret value to an external device, receive, from the external device via the wireless communication interface, information indicative of the secret value, and establish a wireless connection with the external device via the wireless communication interface based on the receipt of the information indicative of the secret value.Type: ApplicationFiled: February 24, 2020Publication date: August 26, 2021Inventors: Joseph Bushmeyer, Cory D. Basden, John H. Bean, JR.
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Patent number: 11060757Abstract: A system for removing condensate from a cooling unit (10) includes a drain pan (44) to collect condensate generated by the cooling unit (10), a condensate pump (52) configured to pump condensate from the drain pan (44), and a water tank (54) in fluid communication with the condensate pump (52). The water tank (54) is configured to store condensate in the form of water delivered to the water tank (54) by the condensate pump (52). The system further includes a plunger pump (60) in fluid communication with the water tank (54). The plunger pump (60) is configured to pump water from the water tank (54). The system further includes at least one atomizing nozzle (62) in fluid communication with the plunger pump (60). The at least one atomizing nozzle (62) is configured to atomize water from the plunger pump (60).Type: GrantFiled: September 8, 2016Date of Patent: July 13, 2021Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Hongwei Yang, John H. Bean, Jr., Jinhui Wang, Marlowe Dulaca Apuhin, Bo Hong
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Publication number: 20210212237Abstract: A system to cool fluid used in information technology equipment (ITE) includes an enclosure having a supply inlet configured to receive supply air from an HVAC supply source and a heat exchanger in fluid communication with at least one ITE unit by a supply line configured to deliver cooled cooling fluid to the at least one ITE unit and a return line configured to deliver warmed cooling fluid to the heat exchanger. The supply air is directed at the heat exchanger to cool the cooling fluid provided in the at least one ITE unit. A method of installing a cooling unit is also disclosed.Type: ApplicationFiled: January 31, 2020Publication date: July 8, 2021Inventor: John H. Bean, JR.
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Patent number: 10952353Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.Type: GrantFiled: August 21, 2019Date of Patent: March 16, 2021Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
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Publication number: 20210059077Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.Type: ApplicationFiled: August 21, 2019Publication date: February 25, 2021Inventors: John H. Bean, JR., James William VanGilder, Roy L. Grantham
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Publication number: 20210018356Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.Type: ApplicationFiled: July 16, 2020Publication date: January 21, 2021Inventors: John H. Bean, JR., Cory D. Basden
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Patent number: 10876748Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, an exhaust fan to move air over the heat exchanger core in a direction perpendicular to the indoor return air, a water collection and management system disposed within the frame below the heat exchanger core to collect water sprayed onto the heat exchanger core, and a water spray system positioned above the heat exchanger core to supply water that is evenly distributed to a top surface of the heat exchanger core. The water spray system includes at least one water spray assembly having an enclosure with a surface, and at least two spray nozzles configured to spray water on a portion of the top surface of the heat exchanger core. Each spray nozzle is configured to produce a flat, fan-shaped spray pattern.Type: GrantFiled: October 11, 2017Date of Patent: December 29, 2020Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Jacob Joseph Rede, John H. Bean, Jr.
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Publication number: 20200355412Abstract: A condenser (404) configured to condense gas phase refrigerant to liquid phase refrigerant. The condenser (404) includes a gas header (408) configured to receive gas phase refrigerant, a liquid header (410) disposed opposite the gas header, the liquid header (410) separated into at least two sections, each section of the at least two sections having a port, and parallel tubes (406) extending between the gas header (408) and the liquid header (410).Type: ApplicationFiled: January 12, 2018Publication date: November 12, 2020Inventors: Jinhui Wang, John H. Bean, JR., Hongwei Yang
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Publication number: 20200355395Abstract: A system for removing condensate from a cooling unit (10) includes a drain pan (44) to collect condensate generated by the cooling unit (10), a condensate pump (52) configured to pump condensate from the drain pan (44), and a water tank (54) in fluid communication with the condensate pump (52). The water tank (54) is configured to store condensate in the form of water delivered to the water tank (54) by the condensate pump (52). The system further includes a plunger pump (60) in fluid communication with the water tank (54). The plunger pump (60) is configured to pump water from the water tank (54). The system further includes at least one atomizing nozzle (62) in fluid communication with the plunger pump (60). The at least one atomizing nozzle (62) is configured to atomize water from the plunger pump (60).Type: ApplicationFiled: September 8, 2016Publication date: November 12, 2020Inventors: Hongwei Yang, John H. Bean, JR., Jinhui Wang, Marlowe Dulaca Apuhin, Bo Hong
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Patent number: 10677544Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, and an outdoor exhaust fan supported by the frame to draw outdoor air over the heat exchanger core in a direction perpendicular to the indoor return air. The system further includes a water spray system positioned above the heat exchanger core to spray water over the heat exchanger core, and a water collection and management system disposed below the heat exchanger core to collect water sprayed onto the heat exchanger core. The water collection and management system includes a water basin configured to contain fluid. The water basin is configured to include an operational water volume and a water reserve volume which together define a total usable water volume, and includes a water height set point to define the water reserve volume.Type: GrantFiled: October 11, 2017Date of Patent: June 9, 2020Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Jacob Joseph Rede, John H. Bean, Jr.
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Patent number: 10317151Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.Type: GrantFiled: April 30, 2018Date of Patent: June 11, 2019Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: John H. Bean, Jr., Roy L. Grantham, Ozan Tutunoglu
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Publication number: 20190107332Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, an exhaust fan to move air over the heat exchanger core in a direction perpendicular to the indoor return air, a water collection and management system disposed within the frame below the heat exchanger core to collect water sprayed onto the heat exchanger core, and a water spray system positioned above the heat exchanger core to supply water that is evenly distributed to a top surface of the heat exchanger core. The water spray system includes at least one water spray assembly having an enclosure with a surface, and at least two spray nozzles configured to spray water on a portion of the top surface of the heat exchanger core. Each spray nozzle is configured to produce a flat, fan-shaped spray pattern.Type: ApplicationFiled: October 11, 2017Publication date: April 11, 2019Inventors: Jacob Joseph Rede, John H. Bean, JR.
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Publication number: 20190107344Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, and an outdoor exhaust fan supported by the frame to draw outdoor air over the heat exchanger core in a direction perpendicular to the indoor return air. The system further includes a water spray system positioned above the heat exchanger core to spray water over the heat exchanger core, and a water collection and management system disposed below the heat exchanger core to collect water sprayed onto the heat exchanger core. The water collection and management system includes a water basin configured to contain fluid. The water basin is configured to include an operational water volume and a water reserve volume which together define a total usable water volume, and includes a water height set point to define the water reserve volume.Type: ApplicationFiled: October 11, 2017Publication date: April 11, 2019Inventors: Jacob Joseph Rede, John H. Bean, JR.
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Patent number: 10247461Abstract: Disclosed herein are aspects and embodiments of an air conditioning system and a method of operating the air conditioning system. In one example, an air conditioning system includes a compressor selectively operated by a first power source and a second power source.Type: GrantFiled: July 19, 2013Date of Patent: April 2, 2019Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventors: Daniel J. Rohr, John H. Bean, Jr., Kevin M. Kemper
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Patent number: 10244664Abstract: A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air.Type: GrantFiled: March 19, 2015Date of Patent: March 26, 2019Assignee: SCHNEIDER ELECTRIC IT CORPORATIONInventor: John H. Bean, Jr.