Patents by Inventor John H. Bean, Jr.

John H. Bean, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11725974
    Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: August 15, 2023
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., Cory D. Basden
  • Publication number: 20230247802
    Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.
    Type: Application
    Filed: August 20, 2020
    Publication date: August 3, 2023
    Inventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
  • Publication number: 20220283014
    Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Inventors: John H. Bean, JR., Cory D. Basden
  • Patent number: 11359955
    Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: June 14, 2022
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., Cory D. Basden
  • Patent number: 11268739
    Abstract: A condenser (404) configured to condense gas phase refrigerant to liquid phase refrigerant. The condenser (404) includes a gas header (408) configured to receive gas phase refrigerant, a liquid header (410) disposed opposite the gas header, the liquid header (410) separated into at least two sections, each section of the at least two sections having a port, and parallel tubes (406) extending between the gas header (408) and the liquid header (410).
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 8, 2022
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Jinhui Wang, John H. Bean, Jr., Hongwei Yang
  • Publication number: 20210266733
    Abstract: Aspects of the disclosure include a peripheral device comprising at least one light-emitting device, a wireless communication interface, and at least one controller configured to receive a wireless connection request at the wireless communication interface, generate a secret value responsive to receiving the wireless connection request, control the light-emitting device to output a signal indicative of the secret value to an external device, receive, from the external device via the wireless communication interface, information indicative of the secret value, and establish a wireless connection with the external device via the wireless communication interface based on the receipt of the information indicative of the secret value.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 26, 2021
    Inventors: Joseph Bushmeyer, Cory D. Basden, John H. Bean, JR.
  • Patent number: 11060757
    Abstract: A system for removing condensate from a cooling unit (10) includes a drain pan (44) to collect condensate generated by the cooling unit (10), a condensate pump (52) configured to pump condensate from the drain pan (44), and a water tank (54) in fluid communication with the condensate pump (52). The water tank (54) is configured to store condensate in the form of water delivered to the water tank (54) by the condensate pump (52). The system further includes a plunger pump (60) in fluid communication with the water tank (54). The plunger pump (60) is configured to pump water from the water tank (54). The system further includes at least one atomizing nozzle (62) in fluid communication with the plunger pump (60). The at least one atomizing nozzle (62) is configured to atomize water from the plunger pump (60).
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 13, 2021
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Hongwei Yang, John H. Bean, Jr., Jinhui Wang, Marlowe Dulaca Apuhin, Bo Hong
  • Publication number: 20210212237
    Abstract: A system to cool fluid used in information technology equipment (ITE) includes an enclosure having a supply inlet configured to receive supply air from an HVAC supply source and a heat exchanger in fluid communication with at least one ITE unit by a supply line configured to deliver cooled cooling fluid to the at least one ITE unit and a return line configured to deliver warmed cooling fluid to the heat exchanger. The supply air is directed at the heat exchanger to cool the cooling fluid provided in the at least one ITE unit. A method of installing a cooling unit is also disclosed.
    Type: Application
    Filed: January 31, 2020
    Publication date: July 8, 2021
    Inventor: John H. Bean, JR.
  • Patent number: 10952353
    Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 16, 2021
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
  • Publication number: 20210059077
    Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 25, 2021
    Inventors: John H. Bean, JR., James William VanGilder, Roy L. Grantham
  • Publication number: 20210018356
    Abstract: A level sensing module for use with a liquid immersion cooling system having a device chassis housing an electronic device, the level sensing module comprising a fluid level sensor, and a controller coupled to the fluid level sensor and configured to receive a signal from the fluid level sensor indicative of a height of dielectric fluid in the device chassis, receive a signal from a pump controller indicative of a volume of dielectric fluid provided to the device chassis, and generate a map of dielectric fluid volume within the device chassis based on the signal from the fluid level sensor and the signal from the pump controller.
    Type: Application
    Filed: July 16, 2020
    Publication date: January 21, 2021
    Inventors: John H. Bean, JR., Cory D. Basden
  • Patent number: 10876748
    Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, an exhaust fan to move air over the heat exchanger core in a direction perpendicular to the indoor return air, a water collection and management system disposed within the frame below the heat exchanger core to collect water sprayed onto the heat exchanger core, and a water spray system positioned above the heat exchanger core to supply water that is evenly distributed to a top surface of the heat exchanger core. The water spray system includes at least one water spray assembly having an enclosure with a surface, and at least two spray nozzles configured to spray water on a portion of the top surface of the heat exchanger core. Each spray nozzle is configured to produce a flat, fan-shaped spray pattern.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: December 29, 2020
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Jacob Joseph Rede, John H. Bean, Jr.
  • Publication number: 20200355412
    Abstract: A condenser (404) configured to condense gas phase refrigerant to liquid phase refrigerant. The condenser (404) includes a gas header (408) configured to receive gas phase refrigerant, a liquid header (410) disposed opposite the gas header, the liquid header (410) separated into at least two sections, each section of the at least two sections having a port, and parallel tubes (406) extending between the gas header (408) and the liquid header (410).
    Type: Application
    Filed: January 12, 2018
    Publication date: November 12, 2020
    Inventors: Jinhui Wang, John H. Bean, JR., Hongwei Yang
  • Publication number: 20200355395
    Abstract: A system for removing condensate from a cooling unit (10) includes a drain pan (44) to collect condensate generated by the cooling unit (10), a condensate pump (52) configured to pump condensate from the drain pan (44), and a water tank (54) in fluid communication with the condensate pump (52). The water tank (54) is configured to store condensate in the form of water delivered to the water tank (54) by the condensate pump (52). The system further includes a plunger pump (60) in fluid communication with the water tank (54). The plunger pump (60) is configured to pump water from the water tank (54). The system further includes at least one atomizing nozzle (62) in fluid communication with the plunger pump (60). The at least one atomizing nozzle (62) is configured to atomize water from the plunger pump (60).
    Type: Application
    Filed: September 8, 2016
    Publication date: November 12, 2020
    Inventors: Hongwei Yang, John H. Bean, JR., Jinhui Wang, Marlowe Dulaca Apuhin, Bo Hong
  • Patent number: 10677544
    Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, and an outdoor exhaust fan supported by the frame to draw outdoor air over the heat exchanger core in a direction perpendicular to the indoor return air. The system further includes a water spray system positioned above the heat exchanger core to spray water over the heat exchanger core, and a water collection and management system disposed below the heat exchanger core to collect water sprayed onto the heat exchanger core. The water collection and management system includes a water basin configured to contain fluid. The water basin is configured to include an operational water volume and a water reserve volume which together define a total usable water volume, and includes a water height set point to define the water reserve volume.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: June 9, 2020
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Jacob Joseph Rede, John H. Bean, Jr.
  • Patent number: 10317151
    Abstract: A water collection system is provided for an indirect evaporative cooler. The water collection system includes a housing having an open bottom, a front wall, a back wall, and two end walls, which together define an interior region of the housing. The water collection system further includes a plurality of tube assemblies each extending through one of the front wall and the back wall of the housing and disposed within the interior region of the housing. The water collection system further includes a plurality of panel assemblies disposed within the interior region of the housing above the plurality of tube assemblies. Each panel assembly is associated with a respective tube assembly to channel fluid to the tube assembly. A method of collecting and distributing water within an indirect evaporative cooler configured to spray water on a heat exchanger is further disclosed.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 11, 2019
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., Roy L. Grantham, Ozan Tutunoglu
  • Publication number: 20190107332
    Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, an exhaust fan to move air over the heat exchanger core in a direction perpendicular to the indoor return air, a water collection and management system disposed within the frame below the heat exchanger core to collect water sprayed onto the heat exchanger core, and a water spray system positioned above the heat exchanger core to supply water that is evenly distributed to a top surface of the heat exchanger core. The water spray system includes at least one water spray assembly having an enclosure with a surface, and at least two spray nozzles configured to spray water on a portion of the top surface of the heat exchanger core. Each spray nozzle is configured to produce a flat, fan-shaped spray pattern.
    Type: Application
    Filed: October 11, 2017
    Publication date: April 11, 2019
    Inventors: Jacob Joseph Rede, John H. Bean, JR.
  • Publication number: 20190107344
    Abstract: An indirect evaporative cooling system includes a frame, a heat exchanger core, a supply fan to move indoor return air inside the heat exchanger core, and an outdoor exhaust fan supported by the frame to draw outdoor air over the heat exchanger core in a direction perpendicular to the indoor return air. The system further includes a water spray system positioned above the heat exchanger core to spray water over the heat exchanger core, and a water collection and management system disposed below the heat exchanger core to collect water sprayed onto the heat exchanger core. The water collection and management system includes a water basin configured to contain fluid. The water basin is configured to include an operational water volume and a water reserve volume which together define a total usable water volume, and includes a water height set point to define the water reserve volume.
    Type: Application
    Filed: October 11, 2017
    Publication date: April 11, 2019
    Inventors: Jacob Joseph Rede, John H. Bean, JR.
  • Patent number: 10247461
    Abstract: Disclosed herein are aspects and embodiments of an air conditioning system and a method of operating the air conditioning system. In one example, an air conditioning system includes a compressor selectively operated by a first power source and a second power source.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: April 2, 2019
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Daniel J. Rohr, John H. Bean, Jr., Kevin M. Kemper
  • Patent number: 10244664
    Abstract: A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: March 26, 2019
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventor: John H. Bean, Jr.