Abstract: Systems and methods related to steerable fields of view are provided. In one embodiment, a system includes an image sensor configured to capture a field of view. The system further includes an optical assembly including an optical element configured to direct the field of view to the image sensor. The system further includes a logic circuit. The logic circuit may send a control signal to the optical assembly to cause rotation of the optical element about an axis associated with the image sensor to adjust the field of view. The logic circuit may send a control signal to the image sensor to cause one or more images of the object to be captured. The logic circuit may calibrate the image sensor based on the one or more images of the object. Related devices and methods are also provided.

Abstract: Various embodiments of the present disclosure may include an imaging system that includes a base module, a camera module, an interface plate, and a locking ring. The base module may be mounted on the interface plate via one or more quick release fasteners. The camera module may then be coupled to the base module and one or more blind mate connectors may allow for the camera of the camera module to quickly connector with the base module and communicate data and/or power. A locking ring may then be coupled (e.g., threaded) onto the base module over the camera module to secure the camera module to the base module.

Abstract: Techniques are disclosed for detection-based wakeup of detection devices. A method may include generating a mapping that includes entries. Each entry may associate a respective detection result of a first detection device with a respective detection result of a second detection device. The method may further include transitioning the second detection device to a first power mode upon completing the generating. The method may further include determining, by the first detection device, that a first object of a first object type is detected based on the mapping. The method may further include transitioning the second detection device out of the first power mode when the first object of the first object type is determined to be detected. The method may further include performing, by the second detection device, at least one action based on the first object. Related systems and devices are also disclosed.

Abstract: Various embodiments of the present disclosure may include an imaging system that includes a base module, a camera module, an interface plate, and a locking ring. The base module may be mounted on the interface plate via one or more quick release fasteners. The camera module may then be coupled to the base module and one or more blind mate connectors may allow for the camera of the camera module to quickly connector with the base module and communicate data and/or power. A locking ring may then be coupled (e.g., threaded) onto the base module over the camera module to secure the camera module to the base module.

Abstract: Various embodiments of the present disclosure may include an imaging system that includes a de-icing assembly. The de-icing assembly may include a de-icing window and a window frame. The de-icing window may be constructed from Float Zone Silicon, single crystal sapphire, and/or germanium. The de-icing assembly may be coupled to a lens barrel of a camera. Heat generated by a heater element of the camera may be conducted via the housing and the lens barrel of the camera to the de-icing assembly. The heated de-icing assembly may prevent the formation of ice on the de-icing window by conducting heat to the de-icing window.

Abstract: Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Abstract: Techniques are disclosed for detection-based wakeup of detection devices. A method may include generating a mapping that includes entries. Each entry may associate a respective detection result of a first detection device with a respective detection result of a second detection device. The method may further include transitioning the second detection device to a first power mode upon completing the generating. The method may further include determining, by the first detection device, that a first object of a first object type is detected based on the mapping. The method may further include transitioning the second detection device out of the first power mode when the first object of the first object type is determined to be detected. The method may further include performing, by the second detection device, at least one action based on the first object. Related systems and devices are also disclosed.

Abstract: Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Abstract: Various embodiments of the present disclosure may include an imaging system that includes a de-icing assembly. The de-icing assembly may include a de-icing window and a window frame. The de-icing window may be constructed from Float Zone Silicon, single crystal sapphire, and/or germanium. The de-icing assembly may be coupled to a lens barrel of a camera. Heat generated by a heater element of the camera may be conducted via the housing and the lens barrel of the camera to the de-icing assembly. The heated de-icing assembly may prevent the formation of ice on the de-icing window by conducting heat to the de-icing window.

Abstract: Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Abstract: Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Abstract: Various techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor various components of a vehicle wheel assembly. For example, a vehicle-mounted system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and a vehicle speed sensor. The vehicle-mounted system may be mounted on, installed in, or otherwise integrated into a vehicle that has one or more wheel assemblies. The one or more infrared imaging modules may be configured to capture thermal images of desired portions of the wheel assemblies. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating condition of various components of the wheel assemblies and to detect abnormalities. Monitoring information may be generated based on the detected condition and abnormalities, and presented to a driver or other occupants onboard the vehicle in real time.