Abstract: A bonding structure for a semiconductor substrate and related method are provided. The bonding structure includes a first oxide layer on the semiconductor substrate, and a second oxide layer on the first oxide layer, the second oxide layer for bonding to another structure. The second oxide layer has a higher stress level than the first oxide layer, and the second oxide layer is thinner than the first oxide layer. The second oxide layer may also have a higher density than the first oxide layer. The bonding structure can be used to bond chips to wafer or wafer to wafer and provides a greater bond strength than just a thick oxide layer.

Abstract: In accordance with the present invention, a protection device is provided for restricting an object from sliding along an edge formed by a pair of surfaces of a structure. The protection device includes an obstruction fixture having a mounting surface and a body projecting away from the mounting surface, and a fastener securing the mounting surface to at least one of the surfaces of the structure. The obstruction fixture is positioned on the structure with the body positioned sufficiently close to the edge such that the object sliding along the edge will contact the body.

Abstract: A protection device is for restricting an object from sliding along an edge formed by a pair of surfaces of a structure. The protection device includes an obstruction fixture having a mounting surface and a body projecting away from the mounting surface, and a fastener securing the mounting surface to at least one of the surfaces of the structure. The obstruction fixture is positioned on the structure with the body positioned sufficiently close to the edge such that the object sliding along the edge will contact the body.