Abstract: A wear-resistant assembly, including: a surface; a base; and a plurality of wear-resistant attachments removably coupled to the base, each of the plurality of wear-resistant attachments including an inner portion and an outer portion, wherein the outer portion of each of the plurality of wear-resistant attachments is coupled to the outer portion of at least one other wear-resistant attachment so that a plurality of coupled wear-resistant attachments include a substantially continuous surface, the substantially continuous surface including at least a portion of the surface of the wear-resistant assembly.

Abstract: A wear-resistant assembly, including: a surface; a base; and a plurality of wear-resistant attachments removably coupled to the base, each of the plurality of wear-resistant attachments including an inner portion and an outer portion, wherein the outer portion of each of the plurality of wear-resistant attachments is coupled to the outer portion of at least one other wear-resistant attachment so that a plurality of coupled wear-resistant attachments include a substantially continuous surface, the substantially continuous surface including at least a portion of the surface of the wear-resistant assembly.

Abstract: A wear-resistant attachment for insertion in a wear-resistant assembly, the assembly comprising a base with at least one recess, the attachment comprising: a bottom part configured to be removably inserted into the recess; and a top part comprising a wear-resistant material, wherein the top part is wider than the bottom part in at least one dimension such that the top part covers a surface of the base beyond the at least one recess.

Abstract: A wear-resistant attachment for insertion in a wear-resistant assembly, the assembly comprising a base with at least one recess, the attachment comprising: a bottom part configured to be removably inserted into the recess; and a top part comprising a wear-resistant material, wherein the top part is wider than the bottom part in at least one dimension such that the top part covers a surface of the base beyond the at least one recess.

Abstract: A method and apparatus for capturing and using design intent within an IC fabrication process. The design intent information is produced along with the design release by a design company. The design release and design intent information are coupled to an IC manufacturing facility where the design release is used for producing the layout of the integrated circuit and the design intent information is coupled to the equipment, especially the metrology equipment, within the IC manufacturing facility. As such, the design intent information can be used to optimize processing during IC fabrication to achieve optimization of the critical characteristics intended by the designer.

Abstract: A method and apparatus for capturing and using design intent within an IC fabrication process. The design intent information is produced along with the design release by a design company. The design release and design intent information are coupled to an IC manufacturing facility where the design release is used for producing the layout of the integrated circuit and the design intent information is coupled to the equipment, especially the metrology equipment, within the IC manufacturing facility. As such, the design intent information can be used to optimize processing during IC fabrication to achieve optimization of the critical characteristics intended by the designer.