Patents by Inventor John H. Pickering

John H. Pickering has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4928995
    Abstract: Cover folders for permanently binding a stack of paper sheets without the use of fasteners. The cover folder has a binder spline which contains a quick drying adhesive which is protected by a removable protective film. The film is removed just prior to use to expose the adhesive. The cover folder allows for quick permanent binding of the stack of paper sheets which are pressed into contact with the adhesive. In alternative embodiments the adhesive may be applied directly to the binder spline from a dispenser and the stack of sheets then inserted in the spline. The dispenser may be in the form of a squeezable tube or pouch positioned in the binder spline. As the tube or pouch is pulled it ruptures, releasing adhesive into the spline channel.
    Type: Grant
    Filed: March 28, 1989
    Date of Patent: May 29, 1990
    Assignee: Dennison Manufacturing Company
    Inventors: John H. Pickering, Sushil K. Bhatia, Mihira K. Rath, Roger N. Chevrette
  • Patent number: 4816322
    Abstract: An electrosensitive substrate from which a metallized surface layer is selectively removed using electrosensitive printing to expose a patterned underlayer. The patterned underlayer may be randomly exposed, or exposed in prescribed portions. Tags, labels or the like of this description may be electrically imprinted with unique identification codes, such as serially printed alphanumeric characters. Such tags and labels resist duplication by conventional printing techniques. The patterned underlayer may be imprinted using inks of a variety of surface textures, resulting in an embossed effect in the metallized surface. Alternatively, a lacquer layer may be provided between the patterned layer and the metallized surface to achieve a uniform appearance of the metallized surface.
    Type: Grant
    Filed: November 2, 1981
    Date of Patent: March 28, 1989
    Assignee: Dennison Manufacturing Company
    Inventor: John H. Pickering
  • Patent number: 4816321
    Abstract: An electrosensitive substrate from which a metallized surface layer is selectively removed using electrosensitive printing to expose a patterned underlayer. The patterned underlayer may be randomly exposed, or exposed in prescribed portions. Tags, labels or the like of this description may be electrically imprinted with unique identification codes, such as serially printed alphanumeric characters. Such tags and labels resist duplication by conventional printing techniques. The patterned underlayer may be imprinted using inks of a variety of surface textures, resulting in an embossed effect in the metallized surface. Alternatively, a lacquer layer may be provided between the patterned layer and the metallized surface to achieve a uniform appearance of the metallized surface.
    Type: Grant
    Filed: September 23, 1983
    Date of Patent: March 28, 1989
    Assignee: Dennison Manufacturing Company
    Inventor: John H. Pickering
  • Patent number: D298520
    Type: Grant
    Filed: May 19, 1986
    Date of Patent: November 15, 1988
    Inventor: John H. Pickering