Patents by Inventor John H. Tangren
John H. Tangren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11147975Abstract: Embodiments of the invention are related to medical devices filled with a liquid composition, amongst other things. In an embodiment, the invention includes a hermetically sealed housing defining an interior volume, a component module disposed within the interior volume, the component module comprising a circuit board, the component module displacing a portion of the interior volume. A liquid composition can be disposed within the housing, the liquid composition filling at least 80% of the interior volume not displaced by the component module. Other embodiments are also included herein.Type: GrantFiled: November 30, 2016Date of Patent: October 19, 2021Assignee: Cardiac Pacemakers, Inc.Inventors: Scott Dahl, John H. Tangren, Kevin Ely, Douglas J. Brandner, William J. Linder
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Publication number: 20210275039Abstract: Embodiments herein relate to body vibration analysis systems and methods. In an embodiment, a body vibration analysis system is included having a first light source configured to illuminate a surface of the body from a first angle with a first set of lighted features and a second light source configured to illuminate a surface of the body from a second angle with a second set of lighted features, wherein the second set of lighted features are optically distinguishable from the first set of lighted features. The system further includes a camera configured to detect light reflected from the surface of the body and a control circuit configured to receive an input from the camera and assess spatial vibration as a function of location on the surface of the body. Other embodiments are also included herein.Type: ApplicationFiled: March 2, 2021Publication date: September 9, 2021Inventors: Jonathan Bennett Shute, John D. Hatlestad, John H. Tangren
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Patent number: 10850106Abstract: An implantable pulse generator includes a device housing containing pulse generator circuitry and a header molded to the device housing. The header can be formed of an epoxy header material. A header component can have a first part molded in the header material to fix the header component to the header at a surface of the header and a second part extending out of the header material.Type: GrantFiled: November 16, 2017Date of Patent: December 1, 2020Assignee: Cardiac Pacemakers, Inc.Inventors: Daragh Nolan, James Michael English, John O'Rourke, Sean Walsh, John H. Tangren, Brian D. Allen
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Publication number: 20180070937Abstract: An implantable pulse generator includes a device housing containing pulse generator circuitry and a header molded to the device housing. The header can be formed of an epoxy header material. A header component can have a first part molded in the header material to fix the header component to the header at a surface of the header and a second part extending out of the header material.Type: ApplicationFiled: November 16, 2017Publication date: March 15, 2018Inventors: Daragh Nolan, James Michael English, John O'Rourke, Sean Walsh, John H. Tangren, Brian D. Allen
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Patent number: 9820733Abstract: An implantable pulse generator includes a device housing containing pulse generator circuitry and a header molded to the device housing. The header can be formed of an epoxy header material. A header component can have a first part molded in the header material to fix the header component to the header at a surface of the header and a second part extending out of the header material.Type: GrantFiled: July 10, 2014Date of Patent: November 21, 2017Assignee: Cardiac Pacemakers, Inc.Inventors: Daragh Nolan, James M. English, John O'Rourke, Sean Walsh, John H. Tangren, Brian D. Allen
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Publication number: 20170080237Abstract: Embodiments of the invention are related to medical devices filled with a liquid composition, amongst other things. In an embodiment, the invention includes a hermetically sealed housing defining an interior volume, a component module disposed within the interior volume, the component module comprising a circuit board, the component module displacing a portion of the interior volume. A liquid composition can be disposed within the housing, the liquid composition filling at least 80% of the interior volume not displaced by the component module. Other embodiments are also included herein.Type: ApplicationFiled: November 30, 2016Publication date: March 23, 2017Inventors: Scott Dahl, John H. Tangren, Kevin Ely, Douglas J. Brandner, William J. Linder
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Patent number: 9008798Abstract: This document describes an apparatus or an implantable medical device including an implantably biocompatible case. The apparatus can include a component that can be sealed within the case. The apparatus can include a vibration isolator and an at least a portion of the vibration isolator can be situated between and compressively preloaded to bias against the case and the component.Type: GrantFiled: December 16, 2013Date of Patent: April 14, 2015Assignee: Cardiac Pacemakers, Inc.Inventors: John H. Tangren, Jean M. Bobgan
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Publication number: 20150018877Abstract: An implantable pulse generator includes a device housing containing pulse generator circuitry and a header molded to the device housing. The header can be formed of an epoxy header material. A header component can have a first part molded in the header material to fix the header component to the header at a surface of the header and a second part extending out of the header material.Type: ApplicationFiled: July 10, 2014Publication date: January 15, 2015Inventors: Daragh Nolan, James M. English, John O'Rourke, Sean Walsh, John H. Tangren, Brian D. Allen
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Publication number: 20140180372Abstract: This document describes an apparatus or an implantable medical device including an implantably biocompatible case. The apparatus can include a component that can be sealed within the case. The apparatus can include a vibration isolator and an at least a portion of the vibration isolator can be situated between and compressively preloaded to bias against the case and the component.Type: ApplicationFiled: December 16, 2013Publication date: June 26, 2014Applicant: Cardiac Pacemakers, Inc.Inventors: John H. Tangren, Jean M. Bobgan
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Patent number: 8301267Abstract: An apparatus comprises an implantable sensor and a signal analyzer circuit communicatively coupled to the implantable sensor. The implantable sensor is configured for coupling to an implantable lead and the implantable sensor provides an electrical vibration sensor signal representative of mechanical vibration of the implantable lead. The signal analyzer circuit is configured to determine a baseline of the vibration sensor signal, detect a change in the vibration sensor signal from the baseline vibration sensor signal, and provide an indication of the change to a user or process.Type: GrantFiled: September 7, 2010Date of Patent: October 30, 2012Assignee: Cardiac Pacemakers, Inc.Inventors: Allan C. Shuros, Dan Li, Krzysztof Z. Siejko, John H. Tangren
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Publication number: 20110071411Abstract: An apparatus comprises an implantable sensor and a signal analyzer circuit communicatively coupled to the implantable sensor. The implantable sensor is configured for coupling to an implantable lead and the implantable sensor provides an electrical vibration sensor signal representative of mechanical vibration of the implantable lead. The signal analyzer circuit is configured to determine a baseline of the vibration sensor signal, detect a change in the vibration sensor signal from the baseline vibration sensor signal, and provide an indication of the change to a user or process.Type: ApplicationFiled: September 7, 2010Publication date: March 24, 2011Inventors: Allan C. Shuros, Dan Li, Krzysztof Z. Siejko, John H. Tangren
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Patent number: 7912548Abstract: An implantable medical device comprising a housing and a limiting structure defining a resonant region in the housing. An acoustic transducer is connected to the limiting structure and extends into the resonant region so that the resonant region mechanically amplifies the deformation of the acoustic transducer at a resonant frequency. An implantable medical device comprising a housing and a limiting structure defining a resonant region in the housing. An acoustic transducer having the shape of a beam is mechanically coupled to the limiting structure and partially extends into the resonant region so that the resonant region mechanically amplifies the deformation of the acoustic transducer at a resonant frequency. An implantable medical device comprising a housing, an acoustic transducer coupled to the housing, and a means for mechanically amplifying the deformation of the acoustic transducer at a resonant frequency. The means defines a resonant region in the housing.Type: GrantFiled: July 20, 2007Date of Patent: March 22, 2011Assignee: Cardiac Pacemakers, Inc.Inventors: Bin Mi, Abhijeet V. Chavan, John H. Tangren
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Publication number: 20090287263Abstract: Embodiments of the invention are related to medical devices filled with a liquid composition, amongst other things. In an embodiment, the invention includes a hermetically sealed housing defining an interior volume, a component module disposed within the interior volume, the component module comprising a circuit board, the component module displacing a portion of the interior volume. A liquid composition can be disposed within the housing, the liquid composition filling at least 80% of the interior volume not displaced by the component module. Other embodiments are also included herein.Type: ApplicationFiled: May 12, 2009Publication date: November 19, 2009Applicant: CARDIAC PACEMAKERS, INC.Inventors: Scott Dahl, John H. Tangren, Kevin J. Ely, Douglas J. Brandner, William J. Linder
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Patent number: 6639757Abstract: A head suspension or head suspension component that includes a spring metal support layer, an insulating layer and a conductive layer, into which three dimensional heat dissipation structures have been integrally formed to dissipate heat from the head suspension, especially in an area adjacent to an integrated circuit mounted on the head suspension. The heat dissipation structures may include a plurality of heat fins formed into or onto one or more conductive traces of the conductive layer, or may include a plurality of projections or indentations formed into or onto conductive traces. Use of a partial etching technique allows for simultaneous etching of both the traces and the heat fins within the traces, thereby decreasing production costs and increasing head suspension reliability. Heat fins may also be formed into the support layer in a region adjacent to the conductive layer heat fins, if desired in order to dissipate even more heat from the region.Type: GrantFiled: January 10, 2001Date of Patent: October 28, 2003Assignee: Hutchinson Technology Inc.Inventors: Catherine A. Morley, Todd A. Krinke, John H. Tangren
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Patent number: 6556382Abstract: A disk drive suspension in which resonance characteristics are adjustable and a method for such adjustment. The disk drive suspension includes a load beam, a head mounting region and one or more mass balancing structures. The mass balancing structures are adapted for permanent displacement or removal to adjust mass distribution of the load beam. In this way, resonance characteristics of the load beam can be adjusted. A method of adjustment includes determination of an adjust location on the load beam at which a resonance characteristic to be adjusted is sensitive to changes in mass. The mass distribution of the load beam are adjusted at this adjust location.Type: GrantFiled: March 28, 1997Date of Patent: April 29, 2003Assignee: Hutchinson Technology, Inc.Inventor: John H. Tangren
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Publication number: 20020089791Abstract: A head suspension or head suspension component that includes a spring metal support layer, an insulating layer and a conductive layer, into which three dimensional heat dissipation structures have been integrally formed to dissipate heat from the head suspension, especially in an area adjacent to an integrated circuit mounted on the head suspension. The heat dissipation structures may include a plurality of heat fins formed into or onto one or more conductive traces of the conductive layer, or may include a plurality of projections or indentations formed into or onto conductive traces. Use of a partial etching technique allows for simultaneous etching of both the traces and the heat fins within the traces, thereby decreasing production costs and increasing head suspension reliability. Heat fins may also be formed into the support layer in a region adjacent to the conductive layer heat fins, if desired in order to dissipate even more heat from the region.Type: ApplicationFiled: January 10, 2001Publication date: July 11, 2002Inventors: Catherine A. Morley, Todd A. Krinke, John H. Tangren
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Patent number: 6246546Abstract: A magnetic head suspension and method of manufacture of the type having a dimple formed in a surface of the head suspension. The dimple comprises a solid protuberance that is partial etched in a surface of the head suspension and then coined by engaging a socket with the partial etched protuberance to form a convex tip portion. The socket can have a hemi-spherical interior surface to form a hemi-spherical coined partial etched dimple. Alternatively, the socket can have a conical interior surface to form a conical coined partial etched dimple. The dimple can be formed on a slider mounting surface of a flexure to act as a static attitude compensation dimple. Alternatively, the dimple can be formed in a loading region of a load beam or in a cantilever region of the flexure to act as a load point dimple.Type: GrantFiled: October 2, 1997Date of Patent: June 12, 2001Assignee: Hutchinson Technology IncorporatedInventor: John H. Tangren
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Patent number: 6154952Abstract: A method of adjusting the static attitude of a head slider attached to a head suspension for use in a rigid disk drive. The head suspension includes a load beam having a mounting region, a rigid region, and a spring region. The head suspension also includes a flexure for supporting a head slider having a read/write head. The flexure is attached to the load beam at at least an attachment isolation structure. The attachment isolation structure includes an attachment area at which the flexure is attached to the load beam; at least one slot surrounding the attachment area; and at least one junction tab traversing the slot to connect the attachment area to the remainder of the head suspension. The attachment area can be displaced by permanently deforming the junction tab. Displacement of the attachment area places a torque on the flexure which causes a displacement, e.g. adjustment, of the head slider attached thereto.Type: GrantFiled: April 22, 1998Date of Patent: December 5, 2000Assignee: Hutchinson Technology, Inc.Inventor: John H. Tangren
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Patent number: 6023574Abstract: A method for designing and manufacturing a head suspension assembly having a side profile in the radius and rigid regions which is optimized for first and second torsion or other resonance characteristics.Type: GrantFiled: March 28, 1997Date of Patent: February 8, 2000Assignee: Hutchinson Technology IncorporatedInventor: John H. Tangren
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Patent number: 5991122Abstract: A method for manufacturing disk drive head suspensions of the type for supporting a transducer head in a loaded state at a fly height above an information storage disk. A desired loaded state side profile for the suspension is determined, for example, by experimental or numerical techniques. The nature and location of one or more weakening structures on the suspension are then determined. The weakening structures will cause the profile of the suspension to change as the suspension moves from an unloaded state to the loaded state, and to have the desired loaded state side profile when in the loaded state at the fly height. Experimental and empirical techniques can be used to determine the nature and location of the weakening structures. A plurality of the suspensions, each having the weakening structures, are then manufactured. Suspension manufactured by the method can be optimized for resonance and other performance-related characteristics.Type: GrantFiled: September 24, 1997Date of Patent: November 23, 1999Assignee: Hutchinson Technology IncorporatedInventors: John H. Tangren, Daniel D. Willard