Patents by Inventor John H. Titizian

John H. Titizian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio frequency power device improvement
    Patent number: 6331931
    Abstract: An radio frequency (RF)/microwave power amplification circuit is disclosed herein having improved power and frequency characteristics. The RF power circuit is characterized by having the output capacitance of the device resonate with a shunt inductance that is physically closer to the device than provided in conventional RF power circuits. This is realized by mounting a direct current (DC) bypass capacitor directly on the same metalized pad that the device terminal is mounted on. By doing this, the inductance associated with a wire bond connection from the device to the capacitor is eliminated or at least reduced. Also disclosed is a dual cell power circuit that consists of matching the impedance characteristics of the active cells to each other by adjusting the circuit parameters in which the active devices interact with.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: December 18, 2001
    Assignee: Integra Technologies, Inc.
    Inventors: John H. Titizian, Jeffrey A. Burger, Young H. Kim
  • Radio frequency power device
    Patent number: 6181200
    Abstract: An radio frequency (RF)/microwave power amplification circuit is disclosed herein having improved power and frequency characteristics. The RF power circuit is characterized by having the output capacitance of the device resonate with a shunt inductance that is physically closer to the device than provided in conventional RF power circuits. This is realized by mounting a direct current (DC) bypass capacitor directly on the same metalized pad that the device terminal is mounted on. By doing this, the inductance associated with a wire bond connection from the device to the capacitor is eliminated or at least reduced. Also disclosed is a dual cell power circuit that consists of matching the impedance characteristics of the active cells to each other by adjusting the circuit parameters in which the active devices interact with.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: January 30, 2001
    Assignee: Integra Technologies, Inc.
    Inventors: John H. Titizian, Jeffrey A. Burger, Young H. Kim