Patents by Inventor John H. V. Roberts

John H. V. Roberts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6869350
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 22, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: John H. V. Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6843712
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: January 18, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: John H. V. Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6682402
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: January 27, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: John H. V Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6293852
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The polishing pads of the present invention are formed by sintering or a combination of sintering and molding (including reaction injection molding). The polishing pads of the present invention are made of an advantageous hydrophilic polishing material and have a surface topography and texture which improves their polishing performance.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: September 25, 2001
    Assignee: Rodel Holdings Inc.
    Inventors: John H. V. Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6217434
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 17, 2001
    Assignee: Rodel Holdings, Inc.
    Inventors: John H. V. Roberts, David B. James, Lee Melbourne Cook