Abstract: A semiconductor structure having silicon dioxide layers of different thicknesses is fabricated by forming a sacrificial silicon dioxide layer on the surface of a substrate; implanting nitrogen ions through the sacrificial silicon dioxide layer into first areas of the semiconductor substrate; implanting chlorine and/or bromine ions through the sacrificial silicon dioxide layer into second areas of the semiconductor substrate where silicon dioxide having the highest thickness is to be formed; removing the sacrificial silicon dioxide layer; and then growing a layer of silicon dioxide on the surface of the semiconductor substrate. The growth rate of the silicon dioxide will be faster in the areas containing the chlorine and/or bromine ions and therefore the silicon dioxide layer will be thicker in those regions as compared to the silicon dioxide layer in the regions not containing the chlorine and/or bromine ions.

Abstract: A semiconductor structure having silicon dioxide layers of different thicknesses is fabricated by forming a sacrificial silicon dioxide layer on the surface of a substrate; implanting nitrogen ions through the sacrificial silicon dioxide layer into first areas of the semiconductor substrate; implanting chlorine and/or bromine ions through the sacrificial silicon dioxide layer into second areas of the semiconductor substrate where silicon dioxide having the highest thickness is to be formed; removing the sacrificial silicon dioxide layer; and then growing a layer of silicon dioxide on the surface of the semiconductor substrate. The growth rate of the silicon dioxide will be faster in the areas containing the chlorine and/or bromine ions and therefore the silicon dioxide layer will be thicker in those regions as compared to the silicon dioxide layer in the regions not containing the chlorine and/or bromine ions.

Abstract: An enhanced electrostatic discharge suppression circuit is disclosed for protecting integrated circuit chips from electrostatic discharges or other potentially damaging voltage transients on an input/output pad. The suppression circuit includes a discharge circuit, electrically coupled to the input/output pad, having a diode comprising a diffusion in a substrate well formed in a substrate. The diffusion is connected to the input/output pad of the integrated circuit. A capacitor is locally provided to couple the substrate well to the substrate. The capacitor is sized to maintain the diode in a forward-bias mode during the electrostatic discharge event, thereby facilitating dissipating of the electrostatic discharge. The capacitor comprises a trench capacitor, which depending upon the configuration, may function as a guard ring for the discharge circuit. Certain beneficial parasitic effects are also discussed in association with integration of a trench capacitor into the suppression circuit.

Abstract: A method of providing access to a multiplexed data bus having a plurality of data processing units coupled thereto. Each unit self-assigns sequence numbers thereto for identification purposes. The unit having the lowest sequence number obtains immediate access to the bus and may relinquish the bus by transmitting a control word, or token, with an incremented sequence number. All units receive the token but only the unit having the incremented sequence number gains access to the bus. The token passing continues through the series of sequence numbers and then recycles when no unit accepts the token (bus timeout). A newly added unit self-assigns a sequence number equal to the one transmitted prior to the bus timeout and thus acquires bus access on the next cycle. If a unit in the cycle fails, a bus timeout occurs mid-cycle and the access loop recycles. The units not gaining access to the bus during the cycle decrement their sequence numbers to close the gap, and hence gain access on the next cycle.