Abstract: Systems and methods are disclosed which facilitate data record organization, searching, and retrieval in connection with large datasets. Data records in large datasets may be organized such that, when a system executes a search of the dataset, each block read responsive to the search contains as many relevant records as possible, minimizing or eliminating cycles spent reading blocks that contain no records that are relevant to the search.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

Abstract: Systems and methods are disclosed which facilitate data record organization, searching, and retrieval in connection with large datasets. Data records in large datasets may be organized such that, when a system executes a search of the dataset, each block read responsive to the search contains as many relevant records as possible, minimizing or eliminating cycles spent reading blocks that contain no records that are relevant to the search.

Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

Abstract: Compression shorts are provided with a sleeve having an opening at a proximal end of the sleeve that communicates with an opening in the crotch area of the shorts. The sleeve is attached to the crotch area of compression shorts by an elastic engagement of the shorts with the sleeve at a proximal end of the sleeve. A flap is joined to the sleeve. The girth of the sleeve and is expanded or contracted by locating and attaching an end of the flap against the sleeve. A distal end of the sleeve comprises a closure flap to permit covering or uncovering a distal opening in the sleeve, and to adjust the useful length of the sleeve.

Abstract: A computerized system and method of managing events surrounding the lifecycle of used and new mobile devices. The system provides a “360 view” that integrates a mobile device's service options, such as financing and device protection, as well as at the device level regarding potential hardware/software errors. This provides an end-to-end view of consumers, such as claims on device protection plans, repayment issues, utilization of upgrades and/or other information in a user's profile across multiple underlying systems during the device's lifecycle.

Abstract: At least certain embodiments of the present disclosure include a method for animating a display region, windows, or views displayed on a display of a device. The method includes starting at least two animations. The method further includes determining the progress of each animation. The method further includes completing each animation based on a single timer.

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: A graphics animation and compositing operations framework has a layer tree for interfacing with the application and a render tree for interfacing with a render engine. Layers in the layer tree can be content, windows, views, video, images, etc., for an application's user interface. The application commits state changes of the layers of the layer tree. The application does not need to include explicit code for animating the changes to the layers. Instead, after a synchronization threshold has been met, an animation is determined for animating the change in state by the framework which can define a set of predetermined animations based on motion, visibility and transition. The determined animation is explicitly applied to the affected layers in the render tree. A render engine renders from the render tree into a frame buffer, synchronized with the display. Portions of the render tree changing relative to prior versions can be tracked.

Abstract: A computerized system and method of managing events surrounding the lifecycle of used and new mobile devices. The system provides a “360 view” that integrates a mobile device's service options, such as financing and device protection, as well as at the device level regarding potential hardware/software errors. This provides an end-to-end view of consumers, such as claims on device protection plans, repayment issues, utilization of upgrades and/or other information in a user's profile across multiple underlying systems during the device's lifecycle.

Abstract: A computerized system and method of managing events surrounding the lifecycle of used and new mobile devices. The system provides a “360 view” that integrates a mobile device's service options, such as financing and device protection, as well as at the device level regarding potential hardware/software errors. This provides an end-to-end view of consumers, such as claims on device protection plans, repayment issues, utilization of upgrades and/or other information in a user's profile across multiple underlying systems during the device's lifecycle.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.