Abstract: A system for 5G radio access networks, that enables smart RF signal repeater devices to perform many of the functions of a 5G base station to extend millimeter wave coverage for 5G communication networks while reducing costs, increasing versatility and optimizing coverage for user devices (UEs). The devices may include outdoor network repeaters and indoor subscriber repeaters, and other mmWave network transmitter devices in a mmWave network. Different types of 5G wireless communication networks may be employed including Open Radio Access Network (O-RAN), and Next Gen Radio Access Network (NG-RAN).

Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: Securely redirecting a system service routine via a provider service table. A service call provider is loaded within an operating system executing in a lower trust security zone. The service call provider comprises metadata indicating a system service routine to be redirected to the service call provider. Based on the metadata, a provider service table is built within a higher trust security zone. The service table redirects the system service routine to the service call provider. Memory page(s) associated with the provider service table are hardware protected, and a read-only view is exposed to the operating system. The provider service table is associated with a user-mode process. A service call for a particular system service routine is received by the operation system from the user-mode process and, based on the provider service table being associated with the user-mode process, the service call is directed to the service call provider.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: A system for 5G radio access networks, that enables smart RF signal repeater devices to perform many of the functions of a 5G base station to extend millimeter wave coverage for 5G communication networks while reducing costs, increasing versatility and optimizing coverage for user devices (UEs). The devices may include outdoor network repeaters and indoor subscriber repeaters, and other mmWave network transmitter devices in a mmWave network. Different types of 5G wireless communication networks may be employed including Open Radio Access Network (O-RAN), and Next Gen Radio Access Network (NG-RAN).

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

Abstract: Compression shorts are provided with a sleeve having an opening at a proximal end of the sleeve that communicates with an opening in the crotch area of the shorts. The sleeve is attached to the crotch area of compression shorts by an elastic engagement of the shorts with the sleeve at a proximal end of the sleeve. A flap is joined to the sleeve. The girth of the sleeve and is expanded or contracted by locating and attaching an end of the flap against the sleeve. A distal end of the sleeve comprises a closure flap to permit covering or uncovering a distal opening in the sleeve, and to adjust the useful length of the sleeve.

Abstract: A computerized system and method of managing events surrounding the lifecycle of used and new mobile devices. The system provides a “360 view” that integrates a mobile device's service options, such as financing and device protection, as well as at the device level regarding potential hardware/software errors. This provides an end-to-end view of consumers, such as claims on device protection plans, repayment issues, utilization of upgrades and/or other information in a user's profile across multiple underlying systems during the device's lifecycle.

Abstract: Securely redirecting a system service routine via a provider service table. A service call provider is loaded within an operating system executing in a lower trust security zone. The service call provider comprises metadata indicating a system service routine to be redirected to the service call provider. Based on the metadata, a provider service table is built within a higher trust security zone. The service table redirects the system service routine to the service call provider. Memory page(s) associated with the provider service table are hardware protected, and a read-only view is exposed to the operating system. The provider service table is associated with a user-mode process. A service call for a particular system service routine is received by the operation system from the user-mode process and, based on the provider service table being associated with the user-mode process, the service call is directed to the service call provider.

Abstract: At least certain embodiments of the present disclosure include a method for animating a display region, windows, or views displayed on a display of a device. The method includes starting at least two animations. The method further includes determining the progress of each animation. The method further includes completing each animation based on a single timer.

Abstract: A system for 5G radio access networks, that enables smart RF signal repeater devices to perform many of the functions of a 5G base station to extend millimeter wave coverage for 5G communication networks while reducing costs, increasing versatility and optimizing coverage for user devices (UEs). The devices may include outdoor network repeaters and indoor subscriber repeaters, and other mmWave network transmitter devices in a mmWave network. Different types of 5G wireless communication networks may be employed including Open Radio Access Network (O-RAN), and Next Gen Radio Access Network (NG-RAN).

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

Abstract: A system for 5G radio access networks, that enables smart RF signal repeater devices to perform many of the functions of a 5G base station to extend millimeter wave coverage for 5G communication networks while reducing costs, increasing versatility and optimizing coverage for user devices (UEs). The devices may include outdoor network repeaters and indoor subscriber repeaters, and other mmWave network transmitter devices in a mmWave network. Different types of 5G wireless communication networks may be employed including Open Radio Access Network (O-RAN), and Next Gen Radio Access Network (NG-RAN).

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.