Patents by Inventor John HARUFF

John HARUFF has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COOLING SYSTEM FOR RF POWER ELECTRONICS
    Publication number: 20200111688
    Abstract: A cooling apparatus is provided. At least one power electronic component is provided. A fluid tight enclosure surrounds the at least one power electronic component. An inert dielectric fluid at least partially fills the fluid tight container and is in contact with the at least one power electronic component.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 9, 2020
    Inventors: Sudhakar Gopalakrishinan, Peter Reimer, John Haruff, John Daugherty
  • Mass flow controller for substrate processing
    Patent number: 10591934
    Abstract: Methods and apparatuses for delivering a process gas to a processing chamber are provided. A mass flow controller includes a first flow line for introducing a process fluid and an inlet valve disposed along the first flow line for controlling a flow rate of the process fluid. The mass flow controller includes a second flow line for introducing a carrier fluid into the mass flow controller and a micro-electro-mechanical system (MEMS) Coriolis sensor for providing a density signal and a mass flow rate signal for a mixture of the process fluid and the carrier fluid. The mass flow controller provided includes an outlet valve for controlling a mass flow rate of the mixture that is output by the mass flow controller as well as a controller for operating the inlet valve based on the density signal and for operating the outlet valve based on the mass flow rate signal.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 17, 2020
    Assignee: Lam Research Corporation
    Inventors: Sudhakar Gopalakrishnan, Peter Reimer, John Haruff, Dennis Smith
  • Mass Flow Controller for Substrate Processing
    Publication number: 20190279888
    Abstract: Methods and apparatuses for delivering a process gas to a processing chamber are provided. A mass flow controller includes a first flow line for introducing a process fluid and an inlet valve disposed along the first flow line for controlling a flow rate of the process fluid. The mass flow controller includes a second flow line for introducing a carrier fluid into the mass flow controller and a micro-electro-mechanical system (MEMS) Coriolis sensor for providing a density signal and a mass flow rate signal for a mixture of the process fluid and the carrier fluid. The mass flow controller provided includes an outlet valve for controlling a mass flow rate of the mixture that is output by the mass flow controller as well as a controller for operating the inlet valve based on the density signal and for operating the outlet valve based on the mass flow rate signal.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 12, 2019
    Inventors: Sudhakar Gopalakrishnan, Peter Reimer, John Haruff, Dennis Smith
  • COOLING SYSTEM FOR RF POWER ELECTRONICS
    Publication number: 20180235110
    Abstract: A cooling apparatus is provided. At least one power electronic component is provided. A fluid tight enclosure surrounds the at least one power electronic component. An inert dielectric fluid at least partially fills the fluid tight container and is in contact with the at least one power electronic component.
    Type: Application
    Filed: February 16, 2017
    Publication date: August 16, 2018
    Inventors: Sudhakar GOPALAKRISHNAN, Peter REIMER, John HARUFF, John DAUGHERTY