Patents by Inventor John Helmuth

John Helmuth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100211180
    Abstract: An orthopedic device having a protective coating bonded to the substrate material of the device. The protective coating includes a thin layer of tetrahedral bonded Carbon (ta-C). The substrate also optionally includes an interface layer to facilitate the initial bonding and retention of the ta-C layer. The ta-C layer has a concentration of sp3 bonded carbon which varies through its thickness, such as varying in individual layers forming the protective coating. The protective coating may also be doped with various materials, either through its thickness, or at either an inner or an outer interface, or both, or include ion diffusion barriers.
    Type: Application
    Filed: March 23, 2010
    Publication date: August 19, 2010
    Applicant: JET ENGINEERING, INC.
    Inventors: John Helmuth, Hans-Joachim Scheibe, Thomas Schuelke, Gary L. Woodrough
  • Publication number: 20070224242
    Abstract: A medical device, such as an orthopedic or prosthetic joint, has a protective coating bonded to the substrate material of the device. Suitable substrate materials may include pure metals and metal alloys, ceramics, polymers and composites of the above. The protective coating includes a thin layer of tetrahedral bonded Carbon (ta-C). The coating also optionally includes an interface layer to facilitate the initial bonding and retention of the ta-C layer, such as by acting as an adhesion promoter, fluid barrier layer, or coefficient of thermal expansion mismatch reducing layer, or combination thereof. The interface layer may include various tightly adherent metals and metal nitrides, such as Cr, Ti, Nb, Ta and carbides, nitrides and carbonitrides thereof. The ta-C layer has a concentration of sp3 bonded carbon which varies through its thickness. Many concentration profiles of sp3 carbon bonds through the thickness are possible.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 27, 2007
    Applicant: JET ENGINEERING, INC.
    Inventors: John Helmuth, Hans-Joachim Scheibe, Thomas Schuelke, Gary Woodrough