Abstract: Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

Abstract: An integrated pressure control system for a workpiece carrier includes a multizone carrier workpiece having multiple pressurizable zones and a pressure control system mounted to the carrier for controlling pressure provided to the pressurizable zones. The present invention also includes a workpiece carrier having a housing, a workpiece bladder coupled to the housing, and at least one pressure transducer mounted to the carrier housing for controlling pressure provided to the workpiece bladder.