Patents by Inventor John Herbert Heiss, Jr.

John Herbert Heiss, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4089704
    Abstract: Disclosed is a method of removing silicone rubber encapsulating material from micro-electronic circuits. The encapsulant is broken down molecularly and removed by a solution of tetramethyl-ammonium hydroxide which is diluted with an alcohol such as 2-propanol. It was found that this stripping solution causes minimal swelling of the encapsulant and leaves no significant residue which cannot be removed by standard rinsing.
    Type: Grant
    Filed: December 27, 1976
    Date of Patent: May 16, 1978
    Assignees: Bell Telephone Laboratories, Incorporated, Western Electric Company Inc.
    Inventors: John Herbert Heiss, Jr., John Robert Wylie
  • Patent number: 4059708
    Abstract: Disclosed is a method for encapsulating selected areas of solid state integrated circuits. The areas which are to remain uncoated are covered with a water and/or alcohol soluble polymer of sufficient viscosity to form stable droplets. The encapsulant is then applied, usually by flow coating, and cured. The polymer mask is removed by applying a material such as water or alcohol which does not affect the encapsulant. The method thus allows relatively small areas to be masked without any significant residue left on the circuit.
    Type: Grant
    Filed: July 30, 1976
    Date of Patent: November 22, 1977
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John Herbert Heiss, Jr., Joel Mark Schoen