Abstract: Devices and methods for optical-fiber processing for connector applications are disclosed, wherein the devices and methods utilize a quantum cascade laser operated under select processing parameters to carry out end face polishing. The method includes supporting the optical fiber in a ferrule so that a bare end section of the fiber protrudes from an end of the ferrule by a protrusion distance. The method then includes irradiating the end face with light from the quantum cascade laser to polish the end face. The quantum cascade laser can also be used to form a bump in a central portion of the end face, wherein the bump facilitates physical contact between respective end faces of connected optical fibers.

Abstract: An electric arc apparatus for processing an optical fiber includes one or more first electrodes and one or more second electrodes. The first electrode(s) each have an end portion that terminates at an opening defined by the first electrode(s). The opening is configured to accommodate the optical fiber extending along a longitudinal axis. The second electrode(s) each have an end portion that terminates at a location spaced from the opening defined by the first electrode(s). The first electrode(s) or second electrode(s) are configured to receive a voltage that generates a plasma field between the first electrode(s) and second electrode(s), which are shaped to focus the plasma field so that the plasma field extends across the longitudinal axis and modifies the end of the optical fiber. Methods of processing an optical fiber with an electric arc apparatus are also disclosed.

Abstract: Devices and methods for optical-fiber processing for connector applications are disclosed, wherein the devices and methods utilize a quantum cascade laser operated under select processing parameters to carry out end face polishing. The method includes supporting the optical fiber in a ferrule so that a bare end section of the fiber protrudes from an end of the ferrule by a protrusion distance. The method then includes irradiating the end face with light from the quantum cascade laser to polish the end face. The quantum cascade laser can also be used to form a bump in a central portion of the end face, wherein the bump facilitates physical contact between respective end faces of connected optical fibers.

Abstract: An electric arc apparatus for processing an optical fiber includes one or more first electrodes and one or more second electrodes. The first electrode(s) each have an end portion that terminates at an opening defined by the first electrode(s). The opening is configured to accommodate the optical fiber extending along a longitudinal axis. The second electrode(s) each have an end portion that terminates at a location spaced from the opening defined by the first electrode(s). The first electrode(s) or second electrode(s) are configured to receive a voltage that generates a plasma field between the first electrode(s) and second electrode(s), which are shaped to focus the plasma field so that the plasma field extends across the longitudinal axis and modifies the end of the optical fiber. Methods of processing an optical fiber with an electric arc apparatus are also disclosed.

Abstract: An electric arc apparatus for processing an optical fiber includes one or more first electrodes and one or more second electrodes. The first electrode(s) each have an end portion that terminates at an opening defined by the first electrode(s). The opening is configured to accommodate the optical fiber extending along a longitudinal axis. The second electrode(s) each have an end portion that terminates at a location spaced from the opening defined by the first electrode(s). The first electrode(s) or second electrode(s) are configured to receive a voltage that generates a plasma field between the first electrode(s) and second electrode(s), which are shaped to focus the plasma field so that the plasma field extends across the longitudinal axis and modifies the end of the optical fiber. Methods of processing an optical fiber with an electric arc apparatus are also disclosed.

Abstract: A torque transmission assembly comprising: (i) an optical fiber coupled to an optical sensing component and capable of rotating and translating the optical sensing component and of transmitting light to and from the optical sensing component; and (b) an annular structure surrounding the optical fiber, the annular structure in conjunction with said optical fiber transmits torque from a rotating component to the optical sensing component, wherein the annular structure does not include a steel wire torque spring.

Abstract: A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 ?m; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.

Abstract: Stub lens assemblies for use in optical coherence tomography. The stub lens assembly has an optical fiber having an end, and an optical fiber ferrule that supports the optical fiber. The stub lens assembly also has a sleeve having a central channel with first and second ends, with the optical fiber ferrule supported within the central channel at the first end. The stub lens assembly further includes a stub lens element having a stub section with a proximal end that resides adjacent the optical fiber end within the central channel of the sleeve. The stub section is formed integral with a lens, which has a lens surface. The sleeve supports the optical fiber end and the proximal end of the stub section in a cooperative optical relationship.

Abstract: Probes optical assemblies and probes for optical coherence tomography (OCT) applications are disclosed. The probe assembly includes an optical fiber, a stub lens and a light-deflecting member arranged in a cooperative optical relationship to define an optical path between the optical fiber end and an image plane that is folded by the light-deflecting member. The optical probe includes a transparent jacket that contains the optical probe assembly.

Abstract: Methods of making a stub lens element and assemblies for coherence tomography (OCT) applications are disclosed. The method of making the stub lens element includes drawing a rod of optical material and processing the drawn rod to form a lens integrally connected to a stub section. The methods also include operably supporting an optical fiber and a stub lens element in a cooperative optical relationship to form a stub lens sub-assembly. The methods also include operably supporting the stub lens sub-assembly and a light-deflecting member in a cooperative optical relationship to form a probe optical assembly that has a folded optical path.

Abstract: A torque transmission assembly comprising: (i) an optical fiber coupled to an optical sensing component and capable of rotating and translating the optical sensing component and of transmitting light to and from the optical sensing component; and (b) an annular structure surrounding the optical fiber, the annular structure in conjunction with said optical fiber transmits torque from a rotating component to the optical sensing component, wherein the annular structure does not include a steel wire torque spring.

Abstract: A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 ?m; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.

Abstract: Probes optical assemblies and probes for optical coherence tomography (OCT) applications are disclosed. The probe assembly includes an optical fiber, a stub lens and a light-deflecting member arranged in a cooperative optical relationship to define an optical path between the optical fiber end and an image plane that is folded by the light-deflecting member. The optical probe includes a transparent jacket that contains the optical probe assembly.

Abstract: Stub lens assemblies for use in optical coherence tomography. The stub lens assembly has an optical fiber having an end, and an optical fiber ferrule that supports the optical fiber. The stub lens assembly also has a sleeve having a central channel with first and second ends, with the optical fiber ferrule supported within the central channel at the first end. The stub lens assembly further includes a stub lens element having a stub section with a proximal end that resides adjacent the optical fiber end within the central channel of the sleeve. The stub section is formed integral with a lens, which has a lens surface. The sleeve supports the optical fiber end and the proximal end of the stub section in a cooperative optical relationship.

Abstract: Methods of making a stub lens element and assemblies for coherence tomography (OCT) applications are disclosed. The method of making the stub lens element includes drawing a rod of optical material and processing the drawn rod to form a lens integrally connected to a stub section. The methods also include operably supporting an optical fiber and a stub lens element in a cooperative optical relationship to form a stub lens sub-assembly. The methods also include operably supporting the stub lens sub-assembly and a light-deflecting member in a cooperative optical relationship to form a probe optical assembly that has a folded optical path.

Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.

Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an ?-cut facet and ?-cut facet. The ?-cut facet of the input face is oriented at a horizontal angle ?, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device.

Abstract: A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.

Abstract: Embodiments of the present disclosure bring a wavelength conversion device into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser diode chip and a clad metal substrate. The clad metal substrate comprises a clad metal region that is mechanically coupled to a base metal region. The laser diode chip is coupled to the clad metal region. The clad metal region comprises a clad metal material having a thermal conductivity that is greater than a thermal conductivity of the base metal material. The clad metal region further comprises a coefficient of thermal expansion that is approximately equal to a coefficient of thermal expansion of the base metal material and is greater than a coefficient of thermal expansion of the laser diode chip.

Abstract: A method for aligning an opto-electronic component assembly (OECA) on a substrate includes positioning a substrate on an assembly surface and positioning an OECA on the substrate such that a first OECA alignment face projects from a first substrate alignment face. The substrate and the OECA are advanced towards a contact face of a first assembly alignment mechanism such that the first substrate alignment face contacts the contact face of the first assembly alignment mechanism after the first OECA alignment face contacts the contact face. The OECA is displaced relative to the first substrate alignment face when the first OECA alignment face contacts the contact face and the substrate continues to move towards the contact face thereby aligning the OECA on the substrate relative to the first substrate alignment face.