Abstract: A method for oil and gas analysis includes receiving measurements from sensing devices instrumented on a blowout preventer, the measurements generated by the plurality of sensing devices over time, storing the measurements in a database, providing a data playback interface to a client device, determining a time range based one or more inputs into the data playback interface, determining one or more data variables selected from a plurality of data variables based the one or more inputs retrieving, from the database, respective values of the one or more data variables corresponding to the time range, generating, one the display, a visual representation of the values of the one or more data variables corresponding to the time range, the visual representation providing playback of the values of the one or more data variables synchronized with respect to time, and displaying the values according to user manipulation of playback control elements.

Abstract: Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.

Abstract: A system, method, and computer-readable medium are disclosed for providing auditability of a distributed ledger technology (DLT) of de-identified data of entities, stored in the DLT. In certain embodiments, data related to an entity is de-identified. The de-identified data is stored in the DLT. Access to the de-identified data is determined. Instances of access to the de-identified data is recorded to the DLT. In certain embodiments, information used to re-identify the de-identified data is store on the DLT. Access to the information can also be determined and recorded to the DLT.

Abstract: Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.

Abstract: A vehicle-grid integration management system determines use of a power grid by an electric vehicle in a dual multi-part rate structure including a grid account portion associated with a relationship between the electric vehicle and the power grid, a group account portion associated with a relationship between the vehicle group and the electric vehicle and/or the power grid, a consumption portion associated with a volume of electricity drawn from the power grid by the electric vehicle over a time period, a supply portion associated with a volume of electricity delivered to the power grid by the electric vehicle over the time period, a demand portion associated with an upper threshold of electricity drawn from the power grid by the electric vehicle over the time period, and a capacity portion associated with an upper threshold of electricity delivered to the power grid by the electric vehicle over the time period.

Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion, a second integrated device coupled to the first metallization portion, a second metallization portion coupled to the first metallization portion through a first plurality of pillar interconnects, a first chiplet located between the first metallization portion and the second metallization portion, wherein the first chiplet is configured to be electrically coupled to the first integrated device through the first metallization portion, and a second chiplet located between the first metallization portion and the second metallization portion, wherein the second chiplet is configured to be electrically coupled to the second integrated device through the first metallization portion.

Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion through a first plurality of pillar interconnects, and a first chiplet located between the first integrated device and the first metallization portion. The first chiplet is coupled to the first integrated device through a first plurality of inter pillar interconnects. The first chiplet may include an active chiplet. The first chiplet may include a passive chiplet.

Abstract: A step iron for a concrete structure, the step iron comprising a body and a leg; the body and leg each comprising a metal core and at least partially encapsulated in a polymer material; the body comprising a tread length to enable a user to use the step iron for climbing; the leg comprising a proximal end nearer the body and a distal end; the distal end of the leg comprising an end section to abut a complementary section of an insert which is fixable and embeddable within a concrete structure; a fixing means mounted on the leg to enable reversible engagement with a complementary section of the insert.

Abstract: A safety integrity level rated control system includes a surface control system and a subsea control system. The surface control system includes one or more remote display panels, one or more buttons operatively connected to each of the remote display panels, two main controllers connected to the remote display panels, two junction boxes, each junction box connected to one of the two main controllers, and a surface intervention system controller connected to the one or more buttons via a wiring bus. The subsea control system is connected to the surface control system by one or more umbilicals extending from the two junction boxes.

Abstract: A vehicle-grid integration management system determines use of a power grid by an electric vehicle in a dual multi-part rate structure including a grid account portion associated with a relationship between the electric vehicle and the power grid, a group account portion associated with a relationship between the vehicle group and the electric vehicle and/or the power grid, a consumption portion associated with a volume of electricity drawn from the power grid by the electric vehicle over a time period, a supply portion associated with a volume of electricity delivered to the power grid by the electric vehicle over the time period, a demand portion associated with an upper threshold of electricity drawn from the power grid by the electric vehicle over the time period, and a capacity portion associated with an upper threshold of electricity delivered to the power grid by the electric vehicle over the time period.

Abstract: Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.

Abstract: A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

Abstract: Systems and methods for optimizing energy distribution are disclosed. Exemplary embodiment may: receive a request for separating a grid sub-network from a greater grid network at a grid point of common coupling, and wherein the greater grid network comprises a first set of premises, a first set of energy resources, and a first set of premise points of common coupling; separate the grid sub-network, wherein the grid sub-network comprises a second set of premises, a second set of energy resources, and a second set of premise points of common coupling; distribute energy from the second set of energy resources to the second set of premises of the grid sub-network; receive a request to reintegrate the grid sub-network to the greater grid network; reintegrate the grid sub-network; and distribute energy from the first set of energy resources to the first set of premises of the greater grid network.

Abstract: A method for oil and gas analysis includes receiving measurements from sensing devices instrumented on a blowout preventer, the measurements generated by the plurality of sensing devices over time, storing the measurements in a database, providing a data playback interface to a client device, determining a time range based one or more inputs into the data playback interface, determining one or more data variables selected from a plurality of data variables based the one or more inputs retrieving, from the database, respective values of the one or more data variables corresponding to the time range, generating, one the display, a visual representation of the values of the one or more data variables corresponding to the time range, the visual representation providing playback of the values of the one or more data variables synchronized with respect to time, and displaying the values according to user manipulation of playback control elements.

Abstract: A system, method, and computer-readable medium are disclosed for providing auditability of a distributed ledger technology (DLT) of de-identified data of entities, stored in the DLT. In certain embodiments, data related to an entity is de-identified. The de-identified data is stored in the DLT. Access to the de-identified data is determined. Instances of access to the de-identified data is recorded to the DLT. In certain embodiments, information used to re-identify the de-identified data is store on the DLT. Access to the information can also be determined and recorded to the DLT.

Abstract: A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

Abstract: Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.

Abstract: Systems and methods for optimizing energy distribution are disclosed. Exemplary embodiment may: receive a request for separating a grid sub-network from a greater grid network at a grid point of common coupling, and wherein the greater grid network comprises a first set of premises, a first set of energy resources, and a first set of premise points of common coupling; separate the grid sub-network, wherein the grid sub-network comprises a second set of premises, a second set of energy resources, and a second set of premise points of common coupling; distribute energy from the second set of energy resources to the second set of premises of the grid sub-network; receive a request to reintegrate the grid sub-network to the greater grid network; reintegrate the grid sub-network; and distribute energy from the first set of energy resources to the first set of premises of the greater grid network.

Abstract: In a first aspect, the invention is directed to a balloon made from a latex composition comprising latex and a metal or metal alloy. In a second aspect, the invention is directed to a process for making such a latex composition.

Abstract: A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.