Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.

Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.

Abstract: In some illustrative embodiments, an incoming signal from a transducer in an ultrasound imaging beam-former apparatus is applied to an in-phase sample-and-hold and a quadrature sample-and-hold. The quadrature sample-and-hold may be clocked a quarter period behind the in-phase sample-and-hold. The output of the sample-and-holds are applied to in-phase and quadrature analog-to-digital converters. A magnitude calculator receives the in-phase and quadrature digital values, and outputs a magnitude. A phase calculator receives the in-phase and quadrature digital values, and outputs a phase. An apodizer applies a difference between an amplitude of the outgoing signal and the magnitude and applies a first illumination to a image point in substantial proportion to the difference, and a phase rotator applies a second illumination to the image point in substantial proportion to the phase.

Abstract: In some illustrative embodiments, an ultrasonic transducer drive includes a signal generator for producing an outgoing signal and a transducer for converting the outgoing signal to outgoing ultrasound. The transducer may also convert at least a portion of ultrasound reflected by an object to an incoming signal. The transducer may have a transmit side connected conductably to the signal generator during at least a first predetermined period of time and a receive side connected conductably to a signal receiver during at least a second predetermined period of time. A shunt may be connectable between the receive side and a reference potential. The signal generator may generate the outgoing signal during at least substantially the first predetermined period of time while the shunt connects the receive side to the reference potential. The signal receiver may receive the incoming signal during substantially the second predetermined period of time while the shunt is substantially open.

Abstract: In some illustrative embodiments, an incoming signal from a transducer in an ultrasound imaging beam-former apparatus is applied to an in-phase sample-and-hold and a quadrature sample-and-hold. The quadrature sample-and-hold may be clocked a quarter period behind the in-phase sample-and-hold. The output of the sample-and-holds are applied to in-phase and quadrature analog-to-digital converters. A magnitude calculator receives the in-phase and quadrature digital values, and outputs a magnitude. A phase calculator receives the in-phase and quadrature digital values, and outputs a phase. An apodizer applies a difference between an amplitude of the outgoing signal and the magnitude and applies a first illumination to a image point in substantial proportion to the difference, and a phase rotator applies a second illumination to the image point in substantial proportion to the phase.

Abstract: An improved device and method for collecting data used for ultrasonic imaging. The data is gathered over numerous transmit and echo receive cycles, or iterations and combined into a synthetic acquisition representing a complete echo characteristic acquisition. At each iteration, only a portion, or subset, of the echo characteristic is sampled and stored. During the iterations, the portion of the echo characteristic that is measured and sampled is varied by changing the relative sampling instants. That is, the time offset from the transmission to the respective sampling instant is varied. The sample sets representative of the entire echo characteristic are then compiled from the multiple subsets of the ultrasonic transmissions.

Abstract: An ultrasound system and related method for forming 2D C-scan images and/or collecting 3D image data from 2D transducer arrays. The system including in part a 2D transducer array of elements, transmit voltage generation means for each element, a memory buffer with or part of channels for each element, and a receive beamformer. On a time serial or sequential basis, several times for each line of firing, the contents of the per element memory buffer are read into the beamformer with different focusing values for each buffer reading cycle. In this way, the beamformer can calculate beamformed image values for multiple points per line firing cycle—or per each line of signals between the transducer array and receive beamformer.

Abstract: A hand held ultrasonic instrument (10) is provided in a portable unit that performs C-Mode imaging and collects 3D image data. In a preferred embodiment a transducer array (60), display unit (20), beamformer (40), power system, and image processor are integrated in one enclosure weighing less than three pounds. In operation, the portable unit is scanned across a target and the displayed image is conveniently presented to the operator whereby the displayed image corresponds exactly to the target, or a scaled fashion if desired.

Abstract: Practical diagnostic ultrasound arrays invariably exhibit a degree of unwanted inter-element cross coupling or cross talk. This results in degraded beam performance that in turn results in degraded image resolution (spatial resolution and contrast performance). Current approaches to reducing inter element coupling may be costly and may make the transducer array fragile. There is a need to overcome the cross talk problem with minimal expense and impact on reliability. The approach taken here overcomes a substantial component of the cross talk with minimal expense. The approach is versatile and has applicability in both transmit and receive. The approach improves image resolution. This technique has particular applicability in the field of silicon substrate based MEMS transducers in which the continuous, low loss, silicon wafer substrate gives rise to significant unwanted cross talk.

Abstract: An ultrasound transducer that allows transmission of pressure waves at a first frequency and reception of pressure waves at a second frequency. Each transducer element is formed by multiple layers of transducer material. A transceiver provides an excitation signal to the transducer and receives energy from the transducer. All of the layers are coupled to the transceiver during transmission so that all of the layers are activated. Some of the layers are decoupled from the transceiver during reception so that not all of the layers contribute to the received signal.

Abstract: An ultrasound transducer having an elevation profile or surface geometry for focusing various frequency ultrasound beams at various focal points. The elevation profile or surface geometry is defined by at least two different geometries.