Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.

Abstract: Acid copper electroplating solutions containing the reaction product of(A) a compound containing a nitrogen-carbon-sulfur radical of the general structural formula ##STR1## where R.sub.1 and R.sub.2 are alkyl radicals a hydrogen atom or mixtures thereof, or ##STR2## where R.sub.3 is an aromatic, heterocyclic or alicyclic radical or their alkyl derivatives, and(B) a compound of the formulaX--R.sub.1 --(S).sub.n --R.sub.2 --Ywhere R.sub.1 and R.sub.2 are the same or different and are substituted or unsubstituted alkylene radicals containing 1 to 6 carbon atoms, X is a functional or non-functional moiety, n is 2, 3, 4, or 5, and Y is a water solubilizing group or a group capable of imparting water solubility to the reaction product in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock.