Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at least one electrical power pad (20).

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at least one electrical power pad (20).

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at feast one electrical power pad (20).

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Abstract: A system (10) and method (200) are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor (18) and at least one electrical power pad (20) comprising a detection pad (28) that is electrically isolated from a remaining portion of the respective at least one electrical power pad (20). A measured parameter at the detection pad (28) provides an indication of electrical connectivity between the at least one power distribution conductor (18) and the respective at feast one electrical power pad (20).

Abstract: Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position.