Abstract: The mapping of electric power distribution circuits and electric power outlets to breakers in a breaker panel is accomplished by providing a plurality of smart power testing devices and a control device that communicates with each of the smart power testing devices. Each of the smart power testing devices is connected to a respective one of the electric power outlets in a structure. Each smart power testing device can detect the AC voltage level provided at the electric power outlet. A user opens each breaker in the breaker panel, in succession. When a smart power testing device senses loss of AC voltage, it transmits a message to the control device. The control device can then identify which outlets are on a common electric power circuit, and by opening each breaker in succession, the control device can creating a mapping of outlets to breakers.

Abstract: A microwave directional coupler includes a microstrip conductor formed on a dielectric substrate and forming a main transmission line having in and out ports that receive signals to be coupled. A substantially U-shaped microstrip conductor is formed over the dielectric substrate adjacent to the main transmission line and forms a secondary transmission line having a coupling section and coupler port. A load resistor is formed within the secondary transmission line, and the coupling section is less than a quarter wavelength of a center frequency.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: The disclosed connector and method transfers high frequency signals from one circuit board to another circuit board, while maintaining good electrical and mechanical performance, at a significantly reduced cost. The connector includes a body member and a conductive pin extending through a center portion of the body member to opposing planar surfaces. An arcuate contact member is positioned within the body member and circumferential to at least a portion of the conductive pin. A flexible conductive material is positioned on an opposing surface and engages the arcuate contact member such that the connector can be positioned between cooperating circuit boards, allowing the conductive pin and arcuate contact member to operatively engage the circuit boards for passing signals therebetween.

Abstract: In one embodiment, the apparatus is adapted to be held beneath and/or behind an animal and comprises a frame having an inner perimeter defining an opening and an outer perimeter, at least two flanges coupled to the outer perimeter of the frame for securing a bag to the frame, and at least one leg coupled to the frame for supporting the frame in a spaced apart relation relative to a support surface.

Abstract: A microwave directional coupler includes a microstrip conductor formed on a dielectric substrate and forming a main transmission line having in and out ports that receive signals to be coupled. A substantially U-shaped microstrip conductor is formed over the dielectric substrate adjacent to the main transmission line and forms a secondary transmission line having a coupling section and coupler port. A load resistor is formed within the secondary transmission line, and the coupling section is less than a quarter wavelength of a center frequency.

Abstract: The disclosed connector and method transfers high frequency signals from one circuit board to another circuit board, while maintaining good electrical and mechanical performance, at a significantly reduced cost. The connector includes a body member and a conductive pin extending through a center portion of the body member to opposing planar surfaces. An arcuate contact member is positioned within the body member and circumferential to at least a portion of the conductive pin. A flexible conductive material is positioned on an opposing surface and engages the arcuate contact member such that the connector can be positioned between cooperating circuit boards, allowing the conductive pin and arcuate contact member to operatively engage the circuit boards for passing signals therebetween.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.