Patents by Inventor John I. Burgin, Jr.

John I. Burgin, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6368045
    Abstract: Disclosed is a tape feeder for use with electronic assembly machines. The feeder simultaneously presents multiple electronic components in a pick up zone for access by a pick up head having a plurality of pick up spindles. The effective feed rate for the electronic components is increased and waiting time for the pick up head is reduced.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: April 9, 2002
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Damon Scott Ashman, Charles Andrew Coots, Mark Jonathan Erickson, Stanislaw Wladyslaw Janisiewicz, Charles H. Dunlap, John I. Burgin, Jr.
  • Patent number: 6041964
    Abstract: A method and apparatus for supplying components wherein a plurality of components are placed on a first end of a track. The components are urged towards a second end of the track with a component stop slidingly mounted at the second end of the track. The urging of the components is discontinued and a vacuum is applied to the first component by the stop. The stop is moved away from the plurality of components to separate the first component from the remaining components.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: March 28, 2000
    Assignee: Universal Instruments Corporation
    Inventors: Ronald F. Tokarz, John I. Burgin, Jr.
  • Patent number: 4762578
    Abstract: The invention involves non-contact sensing of a selected location on a substrate at which material is to be deposited, and positioning of a material depositing tip a preferred distance from this location on the substrate according to such sensing and in preparation for the depositing. Preferably, the tip is advanced to a preferred spacing between it and the substrate, without overshooting the spacing and without contacting the substrate, in preparation for depositing.
    Type: Grant
    Filed: April 28, 1987
    Date of Patent: August 9, 1988
    Assignee: Universal Instruments Corporation
    Inventors: John I. Burgin, Jr., Michael J. Kane, Michael M. Levie