Patents by Inventor John INGWERSEN

John INGWERSEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two-phase helium convection loop for cryogenic cooling
    Patent number: 12631682
    Abstract: Described is a probing system and technique for testing superconducting and low-temperature circuitry at the wafer level. In embodiments, the system includes a helium convection loop such as a passive helium convection loop. The use of a passive helium convection loop enables the use of welded flexible bellows hoses. Also described is a wafer holding structure having a fixed portion configured to be removably secured to a wafer to be tested and a second portion configured to be removably secured to the fixed portion and configured to remain in a testing chamber portion of a wafer probing system and configured to provide force application and alignment functionality to a wafer to be tested.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: May 19, 2026
    Assignee: Massachusetts Institute of Technology
    Inventors: John Cummings, George Haldeman, Lawrence Narkewich, Sergey K. Tolpygo, John Ingwersen
  • Two-Phase Helium Convection Loop for Cryogenic Cooling
    Publication number: 20250224441
    Abstract: Described is a probing system and technique for testing superconducting and low-temperature circuitry at the wafer level. In embodiments, the system includes a helium convection loop such as a passive helium convection loop. The use of a passive helium convection loop enables the use of welded flexible bellows hoses. Also described is a wafer holding structure having a fixed portion configured to be removably secured to a wafer to be tested and a second portion configured to be removably secured to the fixed portion and configured to remain in a testing chamber portion of a wafer probing system and configured to provide force application and alignment functionality to a wafer to be tested.
    Type: Application
    Filed: April 15, 2022
    Publication date: July 10, 2025
    Applicant: Massachusetts Institute of Technology
    Inventors: John CUMMINGS, George HALDEMAN, Lawrence NARKEWICH, Sergey K. TOLPYGO, John INGWERSEN